Peak Diffusing Measurement Method for Estimating Thermal Diffusivity of Thin Films
Open accessAbstract
A novel peak diffusing measurement method is reported. In this method, a pulsed Gaussian heat source is focused on the material’s surface, and a thermal camera is utilized for detecting the temperature evolution. Specially, the peak temperature timetmaxat different distance from the heat source center is extracted using the Singular Spectrum Analysis (SSA). Thermal diffusivity is then calculated by fitting multiple sets of extractedtmaxinto the derived regression equation. The advantage of this method is that it does not require the high precision time synchronization between the excitation source and detector. Also, the calculation process is very simple, which achieves an efficient in situ measurement of the thermal diffusivity. The measured radial thermal diffusivity of samples prepared from Ti and Ni is in good agreement with the reference data with a 1.8% and a 3.9% error bound.
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When Ni applied at the interface (bottom side of Al), it helps reducing the rapid heat transfer from Al to Cu owing to low thermal diffusivity of Ni (αNi ≈ 23 mm2/s), leading to higher heat retention in Al and higher peak temperatures.
“On the other hand, when Ni applied at the interface (bottom side of Al), it helps reducing the rapid heat transfer from Al to Cu owing to low thermal diffusivity of Ni (αNi ≈ 23 mm²/s[32]) leading to higher heat retention in Al and higher peak temperatures.”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [32]
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Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
Parker, W. J., Jenkins, R. J., Butler, C. P., & Abbott, G. L. (1961) · Journal of Applied Physics · doi:10.1063/1.1728417 · Cited by 3,978 · see citing works
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Singh, R., Arora, N., & Choudhary, A. (2026) · Welding in the World · doi:10.1007/s40194-026-02375-5 · Cited by 6 · see citing works
- Authors
- Dong, H. L., Zheng, B. Y., & Chen, F. F.
- Affiliations
- Tsinghua University (CN)
- Corresponding author
- Chen, Fei Fan
- Venue
- Advanced Materials Research
- Publisher
- Trans Tech Publications, Ltd.
- Published
- 2014-10
- Volume
- 1035
- Pages
- 166-172
- ISSN
- 1022-6680 (ISSN-L)
- 1662-8985
- OpenAlex
- W2050468438
- Cited by
- 2
- References
- 1
- Citations by year
- 2026: 1 · 2025: 1
- FWCI
- 0.00
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Advanced materials research (publishedVersion, cc-by)
- Topics
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Keywords
- thermal diffusivity, thin films, thermal camera, singular spectrum analysis, in situ measurement, titanium, nickel
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