Silberschmidt, Vadim V.

Loughborough University

1 paper on CoChatORCID 0000-0003-3338-3311

Most cited papers

Verified
Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization
Xu, H., Liu, C., Silberschmidt, V. V., & Chen, Z. (2010) · Journal of Electronic Materials
Electronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Cited by 79

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