Cui, Han

PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling

Tian, X., Jia, N., DeVoto, D., Paret, P., Bai, H., Tolbert, L. M., & Cui, H. (2024) · IEEE Transactions on Power Electronics

Silicon Carbide Semiconductor TechnologiesGaN-based semiconductor devices and materials

Cited by 40

An Embedded GaN Power Module with Double-Sided Cooling and High-Density Integration

Tian, X., Jia, N., Chertkovsky, D. B., Sun, J., Bai, H., Tolbert, L. M., & Cui, H. (2022) · 2022 IEEE Energy Conversion Congress and Exposition (ECCE)

Silicon Carbide Semiconductor TechnologiesGaN-based semiconductor devices and materials

Cited by 15