Wang, Wenbo

Yongjiang Laboratory

1 paper on CoChatORCID 0000-0003-1379-739X

Most cited papers

Verified
Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
Wang, L., Wang, W., Hueting, R. J. E., Rietveld, G., & Ferreira, J. A. (2023) · IEEE Transactions on Power Electronics
Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies
Cited by 73

Go further with a free account

Verify every reference, keep papers in a library, and ask questions across them.

Sign up - it is free