Chen, Jiunn

Advanced Semiconductor Engineering (Taiwan)

1 paper on CoChatORCID 0000-0001-5601-5293

Most cited papers

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Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
Chen, J., Lai, Y.-S., Wang, Y.-W., & Kao, C. R. (2011) · Microelectronics Reliability
Electronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Cited by 56

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