Rietveld, Gert

VSL National Metrology Institute · University of Twente

1 paper on CoChatORCID 0000-0002-5239-4019

Most cited papers

Verified
Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
Wang, L., Wang, W., Hueting, R. J. E., Rietveld, G., & Ferreira, J. A. (2023) · IEEE Transactions on Power Electronics
Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies
Cited by 73

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