Kim, Dongjin

The Institute of Scientific and Industrial Research, The University of Osaka · The University of Osaka

1 paper on CoChatORCID 0000-0002-6814-6132

Most cited papers

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Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules with Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip
Kim, D., Nagao, S., Chen, C., Wakasugi, N., Yamamoto, Y., Suetake, A., Takemasa, T., Sugahara, T., & Suganuma, K. (2021) · IEEE Transactions on Power Electronics
Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies
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