Wang, Meiyu

Nankai University

1 paper on CoChatORCID 0000-0002-8466-3105

Most cited papers

Verified
Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging
Wang, M., Mei, Y.-H., Jin, J., Chen, S., Li, X., & Lu, G.-Q. (2021) · IEEE Transactions on Power Electronics
Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies
Cited by 69

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