Lai, Yi-Shao

Advanced Semiconductor Engineering (Taiwan)

1 paper on CoChatORCID 0000-0003-3550-9256

Most cited papers

Verified
Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
Chen, J., Lai, Y.-S., Wang, Y.-W., & Kao, C. R. (2011) · Microelectronics Reliability
Electronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Cited by 56

Go further with a free account

Verify every reference, keep papers in a library, and ask questions across them.

Sign up - it is free