Ye, Huaiyu

Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Liu, X., Zhou, Q., Zhao, X., Koh, S. W., Ye, H., & Zhang, G. (2021) · 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Electronic Packaging and Soldering Technologies3D IC and TSV technologies

Cited by 12

Simulation Study on Thermal Mechanical Properties of Different Embedded Packaging Structures and Materials of GaN Devices

Zhang, C., Liu, X., Li, J., Song, G., & Ye, H. (2020) · 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

GaN-based semiconductor devices and materialsElectronic Packaging and Soldering Technologies

Cited by 10