Kraft, Silke

Fraunhofer Institute for Integrated Systems and Device Technology

1 paper on CoChat

Most cited papers

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Reliability assessment of sintered nano-silver die attachment for power semiconductors
Knoerr, M., Kraft, S., & Schletz, A. (2010) · 2010 12th Electronics Packaging Technology Conference
Electronic Packaging and Soldering Technologies3D IC and TSV technologies
Cited by 184

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