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Cited by 184Electronic Packaging and Soldering Technologies3D IC and TSV technologiesSilicon Carbide Semiconductor Technologies

The DOI matches its Crossref record; 12 of the 12 references it cites were found in a registry or an index.

Reliability assessment of sintered nano-silver die attachment for power semiconductors

Knoerr, Matthias, Kraft, Silke, Schletz, Andreas·2010·2010 12th Electronics Packaging Technology Conference
DOI 10.1109/eptc.2010.5702605
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Abstract

For decades soldering has been the technology of choice in die bonding. However, due to worldwide health protection regulations, the most common solder alloys, which contain lead, have been banned. Furthermore, standard solders cannot fulfil the reliability requirements of future power electronic devices. New interconnection technologies have to be developed. One of them is pressure sintering (p=30..50 MPa) of silver flakes below 300°C. It forms a strong, highly electrically and thermally conductive bond. In order to lower the level of pressure, silver nanoparticles can be used. Shear tests have shown that even 5 s of sintering, a temperature of 225°C, or a pressure as low as 2 MPa is sufficient to generate bonds comparable to solder and high pressure sinter joints if the remaining parameters (p, t and T, respectively) are set correctly. However, strength is only a necessary criterion as aging comes into play. Therefore, reliability tests using thermal cycling and power cycling were run. These returned superior reliability of the sintered samples. 160 million of the power cycles between +45 and +175°C run in this work can be extrapolated using a Coffin-Manson model. Solder joints failed at about 40,000 cycles.

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Crossref · 10.1109/eptc.2010.5702605

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Research works printed but not linked: 6

  1. rudzki, 2009, Reliability of Ag Sintering vs. Soldering, ECPE Seminar Advanced Power Electronics Packaging
  2. mertens, 2004, Die Niedertemperatur-Verbindungstechnik der Leistungselektronik
  3. klaka, 1997, Eine Niedertemperatur-Verbindungstechnik Zum Aufbau Von Leistungshalbleitermodulen
  4. zhang, 2005, Low-temperature Sintering Nanoscale Silver Paste as an High-Temperature package Solution, Proc CPES Power Electronics Conf
  5. rudzki, 2006, Aufbaukonzepte fr die leistungselektronik mit der niedertemperatur-verbindungstechnik
  6. knoerr, 2010, Power Semiconductor Joining through Sintering of Ag-Nanoparticles: Analysis of Suitability of Different Powders Using DSC and TGA Measurements, Abstracts and Proceedings of The World Congress on Particle Technology (WCPT6)

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Metadata

Authors
Knoerr, M., Kraft, S., & Schletz, A.
Affiliations
Fraunhofer Institute for Integrated Systems and Device Technology (DE)
ORCID
Schletz, Andreas
Venue
2010 12th Electronics Packaging Technology Conference
Publisher
IEEE
Published
2010-12
Pages
56-61
DOI
10.1109/eptc.2010.5702605
OpenAlex
W2142210263
Cited by
184
References
12
Citations by year
2026: 6 · 2025: 12 · 2024: 13 · 2023: 7 · 2022: 11 · 2021: 17 · 2020: 11 · 2019: 14 · 2018: 12 · 2017: 6 · 2016: 17 · 2015: 12 · 2014: 11 · 2013: 18 · 2012: 12
FWCI
14.82
Type
conference paper
Language
en
Open access
closed
Locations
  • IEEE Electronics Packaging Technology Conference (EPTC) (publishedVersion)
  • Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (submittedVersion)
  • Fraunhofer-Publica (Fraunhofer-Gesellschaft) (submittedVersion)
Funders
European Commission
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
Keywords
silver nanoparticles, hot pressing, power semiconductor devices, lead-free solder alternatives, die attach, shear strength, thermal cycling, power cycling, Coffin-Manson equation, reliability, solder joint failure

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