Ferreira, Jan

Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement

Yang, F., Lixin, J., Wang, L., Zhang, F., Wang, B., Zhao, C., Wang, J., Bayer, C., & Ferreira, J. (2022) · IEEE Transactions on Power Electronics

Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies

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Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging

Wang, L., Wang, W., Hueting, R. J. E., Rietveld, G., & Ferreira, J. A. (2023) · IEEE Transactions on Power Electronics

Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies

Cited by 73