The DOI matches its Crossref record.
Nanoporous Structures Prepared by an Electrochemical Deposition Process
Abstract
Free‐standing metal foam structures with nano‐dendritic walls of copper and tin are fabricated by an electrochemical deposition process. This unique structure is attributed to the concurrent generation of hydrogen bubbles with extremely fast metal deposition at high cathodic current densities. The Figure shows a typical example of the foam‐like structure of tin deposits with walls composed of nano‐dendritic branches.
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Citations
Cited by
Zhu, C., Du, D., Eychmüller, A., & Lin, Y. (2015) · Chemical Reviews · doi:10.1021/acs.chemrev.5b00255 · Cited by 672
Electrochemical Reduction of CO2 at Copper Nanofoams
Sen, S., Liu, D., & Palmore, G. T. R. (2014) · ACS Catalysis · doi:10.1021/cs500522g · Cited by 528
Gas Bubbles in Electrochemical Gas Evolution Reactions
Zhao, X., Ren, H., & Luo, L. (2019) · Langmuir · doi:10.1021/acs.langmuir.9b00119 · Cited by 457
Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis
Hoang, T. T. H., Ma, S., Gold, J. I., Kenis, P. J. A., & Gewirth, A. A. (2017) · ACS Catalysis · doi:10.1021/acscatal.6b03613 · Cited by 296
Metadata
- Authors
- Shin, H. ‐., Dong, J., & Liu, M.
- Venue
- Advanced Materials
- Publisher
- Wiley
- Published
- 2003-10-02
- Volume
- 15
- Issue
- 19
- Pages
- 1610-1614
- ISSN
- 0935-9648 (ISSN-L)
- 1521-4095
- OpenAlex
- W2121707981
- Cited by
- 618
- References
- 0
- FWCI
- 5.36
- Type
- journal article
- Language
- en
- Open access
- closed
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- Shin, H. ‐., Dong, J., & Liu, M. (2003). Nanoporous Structures Prepared by an Electrochemical Deposition Process. Advanced Materials. https://doi.org/10.1002/adma.200305160
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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