The DOI matches its Crossref record; 3 of the 3 references it cites were found in a registry or an index.
Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking
Abstract
Electrostatic flocking is applied to create an array of aligned carbon fibers from which an elastomeric thermal interface material (TIM) can be fabricated with a high through-plane thermal conductivity of 23.3 W/mK. A high thermal conductivity can be achieved with a significantly low filler level (13.2 wt%). As a result, this material retains the intrinsic properties of the matrix, i.e., elastomeric behavior.
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Cites
Thermal properties of graphene and nanostructured carbon materials
Balandin, A. A. (2011) · Nature Materials · doi:10.1038/nmat3064 · Cited by 6,244
Thermal Transport Measurements of Individual Multiwalled Nanotubes
Kim, P., Shi, L., Majumdar, A., & McEuen, P. L. (2001) · Physical Review Letters · doi:10.1103/physrevlett.87.215502 · Cited by 3,378
Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
Shahil, K. M. F., & Balandin, A. A. (2012) · Nano Letters · doi:10.1021/nl203906r · Cited by 1,467
Cited by
Novel nanostructured thermal interface materials: a review
Hansson, J., Nilsson, T. M. J., Ye, L., & Liu, J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1301014 · Cited by 441
Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials
Dai, W., Ma, T., Yan, Q., Gao, J., Tan, X., Lv, L., Hou, H., Wei, Q., Yu, J., Wu, J., et al. (2019) · ACS Nano · doi:10.1021/acsnano.9b05163 · Cited by 348
Carbon Nanomaterials in Different Dimensions for Electrochemical Energy Storage
Ni, J., & Li, Y. (2016) · Advanced Energy Materials · doi:10.1002/aenm.201600278 · Cited by 304
Morishita, T., & Okamoto, H. (2016) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.6b08404 · Cited by 257
Metadata
- Authors
- Uetani, K., Ata, S., Tomonoh, S., Yamada, T., Yumura, M., & Hata, K.
- Venue
- Advanced Materials
- Publisher
- Wiley
- Published
- 2014-07-08
- Volume
- 26
- Issue
- 33
- Pages
- 5857-5862
- ISSN
- 0935-9648 (ISSN-L)
- 1521-4095
- OpenAlex
- W2058660567
- Cited by
- 315
- References
- 3
- FWCI
- 5.21
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking. https://app.cochat.ai/papers/10.1002/adma.201401736
- The paper
- Uetani, K., Ata, S., Tomonoh, S., Yamada, T., Yumura, M., & Hata, K. (2014). Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking. Advanced Materials. https://doi.org/10.1002/adma.201401736
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
