The DOI matches its Crossref record; 125 of the 125 references it cites were found in a registry or an index.
Novel nanostructured thermal interface materials: a review
Abstract
The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
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Cites
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Cited by
Thermal conductivity of carbon nanotube networks: a review
Kumanek, B., & Janas, D. (2019) · Journal of Materials Science · doi:10.1007/s10853-019-03368-0 · Cited by 486
Present and future thermal interface materials for electronic devices
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Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials
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Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review
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Thermal Transport in Conductive Polymer–Based Materials
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Metadata
- Authors
- Hansson, J., Nilsson, T. M. J., Ye, L., & Liu, J.
- Venue
- International Materials Reviews
- Publisher
- SAGE Publications
- Published
- 2017-04-19
- Volume
- 63
- Issue
- 1
- Pages
- 22-45
- ISSN
- 0950-6608 (ISSN-L)
- 1743-2804
- OpenAlex
- W2605822643
- Cited by
- 441
- References
- 125
- FWCI
- 11.07
- Type
- journal article
- Language
- en
- Open access
- closed
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- Hansson, J., Nilsson, T. M. J., Ye, L., & Liu, J. (2018). Novel nanostructured thermal interface materials: a review. International Materials Reviews. https://doi.org/10.1080/09506608.2017.1301014
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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
