The DOI matches its Crossref record.
Materials for Advanced Packaging
Abstract
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Overview
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Citations
Cited by
Polymeric Biomaterials for Medical Implants and Devices
Teo, A. J. T., Mishra, A., Park, I., Kim, Y.-J., Park, W.-T., & Yoon, Y.-J. (2016) · ACS Biomaterials Science & Engineering · doi:10.1021/acsbiomaterials.5b00429 · Cited by 778
Lin, Z., Liu, Y., Raghavan, S., Moon, K.-S., Sitaraman, S. K., & Wong, C.-P. (2013) · ACS Applied Materials & Interfaces · doi:10.1021/am401939z · Cited by 469
Metadata
- Venue
- Springer eBooks
- Publisher
- Springer US
- Published
- 2009
- OpenAlex
- W590555423
- Cited by
- 294
- References
- 0
- FWCI
- 4.88
- Type
- book
- Language
- en
- Open access
- closed
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- Materials for Advanced Packaging. (2009). Springer eBooks. https://doi.org/10.1007/978-0-387-78219-5
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.