The DOI matches its Crossref record; 11 of the 11 references it cites were found in a registry or an index.
Forced air cooling by using manifold microchannel heat sinks
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Using air as a cooling medium is employed early [17], but without obtaining thermal-hydraulic performance correlations.”
From Compact and microchannel heat exchangers: A comprehensive review of air-side friction factor and heat transfer correlations (2018) · cites this paper as [17]
Citations
Cites
High-performance heat sinking for VLSI
Tuckerman, D. B., & Pease, R. F. W. (1981) · IEEE Electron Device Letters · doi:10.1109/edl.1981.25367 · Cited by 5,373
Heat sink optimization with application to microchannels
Knight, R. W., Hall, D. J., Goodling, J. S., & Jaeger, R. C. (1992) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.180049 · Cited by 409
Phillips, R. J. (1988) · Cited by 230
Optimal Thermal Design of Forced Convection Heat Sinks-Analytical
Knight, R. W., Goodling, J. S., & Hall, D. J. (1991) · Journal of Electronic Packaging · doi:10.1115/1.2905412 · Cited by 218
Micro-channel heat exchanger optimization
Harpole, G. M., & Eninger, J. E. (2002) · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · doi:10.1109/stherm.1991.152913 · Cited by 188
High performance forced air cooling scheme employing microchannel heat exchangers
Kleiner, M. B., Kuhn, S. A., & Haberger, K. (1995) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.477466 · Cited by 138
Narrow Channel Forced Air Heat Sink
Goldberg, N. (1984) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1984.1136326 · Cited by 82
Optimal thermal design of air cooled forced convection finned heat sinks-experimental verification
Knight, R. W., Goodling, J. S., & Gross, B. (1992) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.180040 · Cited by 58
Advanced micro air-cooling systems for high density packaging
Gromoll, B. (2002) · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · doi:10.1109/stherm.1994.288994 · Cited by 29
ANALYSIS AND EXPERIMENT ON GAS CONVECTION MICROCHANNEL HEAT EXCHANGERS
Yu, S., & Xin, M. (1994) · International Heat Transfer Conference (IHTC) · doi:10.1615/ihtc10.2210 · Cited by 5
Cooling of Electronic Systems by Using Manifold Microchannel Heat Sinks
Park, B. C., Copeland, D., & Nakayama, W. (1995) · 대한기계학회 춘추학술대회 · Cited by 4
Research works printed but not linked: 1
- Phillips, R. J., 1990, “Microchannel Heat Sinks,”in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 3, ASME Press.
Cited by
Sorted by citations
Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging
Fedorov, A. G., & Viskanta, R. (2000) · International Journal of Heat and Mass Transfer · doi:10.1016/s0017-9310(99)00151-9 · Cited by 453
Rahimi‐Gorji, M., Pourmehran, O., Hatami, M., & Ganji, D. D. (2015) · The European Physical Journal Plus · doi:10.1140/epjp/i2015-15022-8 · Cited by 192
Jung, K. W., Kharangate, C. R., Lee, H., Palko, J. W., Zhou, F., Asheghi, M., Dede, E. M., & Goodson, K. E. (2018) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2018.10.108 · Cited by 189
A novel high performance, ultra thin heat sink for electronics
Escher, W., Michel, B., & Dimos Poulikakos, A. (2010) · International Journal of Heat and Fluid Flow · doi:10.1016/j.ijheatfluidflow.2010.03.001 · Cited by 156
Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling
Dede, E. M. (2012) · Journal of Electronic Packaging · doi:10.1115/1.4007159 · Cited by 142
Metadata
- Authors
- Kim, Y. H., Chun, W. C., Kim, J. T., Pak, B. C., & Baek, B. J.
- Affiliations
- Jeonbuk National University (KR)
- ORCID
- Kim, Yong H
- Venue
- KSME International Journal
- Published
- 1998-07
- Volume
- 12
- Issue
- 4
- Pages
- 709-718
- ISSN
- 1226-4865 (ISSN-L)
- OpenAlex
- W2155489237
- Cited by
- 58
- References
- 11
- Citations by year
- 2026: 6 · 2025: 5 · 2024: 3 · 2023: 6 · 2022: 1 · 2020: 2 · 2019: 3 · 2018: 7 · 2017: 2 · 2016: 2 · 2015: 5 · 2014: 3 · 2013: 3 · 2012: 1
- FWCI
- 1.28
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.springer.com/tdm (tdm)
- Locations
- KSME International Journal (publishedVersion)
- Funders
- Korea Science and Engineering Foundation
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer Mechanisms
- Keywords
- manifold microchannel heat sink, forced air cooling, thermal resistance, microchannel heat sinks, geometric parameter optimization, pumping power, microchannel width, heat sink design
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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