Cited by 58Heat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms

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Forced air cooling by using manifold microchannel heat sinks

Kim, Yong H, Chun, Woo Chong, Kim, Jin Taek, Pak, Bock Choon, Baek, Byoung Joon·1998·KSME International Journal

DOI 10.1007/bf02945732

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High-performance heat sinking for VLSI
Tuckerman, D. B., & Pease, R. F. W. (1981) · IEEE Electron Device Letters · doi:10.1109/edl.1981.25367 · Cited by 5,373
Heat sink optimization with application to microchannels
Knight, R. W., Hall, D. J., Goodling, J. S., & Jaeger, R. C. (1992) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.180049 · Cited by 409
Microchannel heat sinks
Phillips, R. J. (1988) · Cited by 230
Optimal Thermal Design of Forced Convection Heat Sinks-Analytical
Knight, R. W., Goodling, J. S., & Hall, D. J. (1991) · Journal of Electronic Packaging · doi:10.1115/1.2905412 · Cited by 218
Micro-channel heat exchanger optimization
Harpole, G. M., & Eninger, J. E. (2002) · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · doi:10.1109/stherm.1991.152913 · Cited by 188
High performance forced air cooling scheme employing microchannel heat exchangers
Kleiner, M. B., Kuhn, S. A., & Haberger, K. (1995) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.477466 · Cited by 138
Narrow Channel Forced Air Heat Sink
Goldberg, N. (1984) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/tchmt.1984.1136326 · Cited by 82
Optimal thermal design of air cooled forced convection finned heat sinks-experimental verification
Knight, R. W., Goodling, J. S., & Gross, B. (1992) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.180040 · Cited by 58
Advanced micro air-cooling systems for high density packaging
Gromoll, B. (2002) · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · doi:10.1109/stherm.1994.288994 · Cited by 29
ANALYSIS AND EXPERIMENT ON GAS CONVECTION MICROCHANNEL HEAT EXCHANGERS
Yu, S., & Xin, M. (1994) · International Heat Transfer Conference (IHTC) · doi:10.1615/ihtc10.2210 · Cited by 5

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Phillips, R. J., 1990, “Microchannel Heat Sinks,”in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 3, ASME Press.

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Authors: Kim, Y. H., Chun, W. C., Kim, J. T., Pak, B. C., & Baek, B. J.
Affiliations: Jeonbuk National University (KR)
ORCID: Kim, Yong H
Venue: KSME International Journal
Publisher: Springer Science and Business Media LLC
Published: 1998-07
Volume: 12
Issue: 4
Pages: 709-718
ISSN: 1226-4865 (ISSN-L)
DOI: 10.1007/bf02945732
OpenAlex: W2155489237
Cited by: 58
References: 11
Citations by year: 2026: 6 · 2025: 5 · 2024: 3 · 2023: 6 · 2022: 1 · 2020: 2 · 2019: 3 · 2018: 7 · 2017: 2 · 2016: 2 · 2015: 5 · 2014: 3 · 2013: 3 · 2012: 1
FWCI: 1.28
Type: journal article
Language: en
Open access: closed
Licence: www.springer.com/tdm (tdm)
Locations: KSME International Journal (publishedVersion)
Funders: Korea Science and Engineering Foundation
Topics: Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer Mechanisms
Keywords: manifold microchannel heat sink, forced air cooling, thermal resistance, microchannel heat sinks, geometric parameter optimization, pumping power, microchannel width, heat sink design

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