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Inkjet printed electronics using copper nanoparticle ink

Open access
Kang, Jin Sung, Kim, Hak Sung, Ryu, Jongeun, Thomas Hahn, H., Jang, Seonhee, Joung, Jae Woo·2010·Journal of Materials Science: Materials in Electronics

Abstract

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200 °C of low temperature in N 2 gas condition. The printed electrodes were made with various widths and thickness. In order to control the thickness of the printed electrode, number of printing was varied. Resistivity of printed electrode was calculated from the cross-sectional area measured by a profilometer and resistance measured by a digital multimeter. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). From the study, it was found that 10 times printed electrode has the most stable grain structure and low resistivity of 36.7 nΩ m.

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Metadata

Authors
Kang, J. S., Kim, H. S., Ryu, J., Thomas Hahn, H., Jang, S., & Joung, J. W.
Venue
Journal of Materials Science: Materials in Electronics
Published
2010-01-08
Volume
21
Issue
11
Pages
1213-1220
ISSN
  • 0957-4522 (ISSN-L)
  • 1573-482X
OpenAlex
W2057241314
Cited by
208
References
0
FWCI
8.72
Type
journal article
Language
en
Open access
hybrid

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CoChat. (2026). Citation check: Inkjet printed electronics using copper nanoparticle ink. https://app.cochat.ai/papers/10.1007/s10854-009-0049-3
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Kang, J. S., Kim, H. S., Ryu, J., Thomas Hahn, H., Jang, S., & Joung, J. W. (2010). Inkjet printed electronics using copper nanoparticle ink. Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/s10854-009-0049-3

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.