The DOI matches its Crossref record; 23 of the 23 references it cites were found in a registry or an index.
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
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In the citing paper
“Hua et al. [16] have modelled the growth of intermetallic and shown that prediction of diffusion rates is improved by considering the unique concentration gradients across the weld.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [16]
In the citing paper
“Their findings indicate that the weld structure (i.e. the number of intermetallic compounds and constituent elements present along with the relative thickness ratios of the layers) will impact the overall diffusion rate.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [16]
Citations
Cites
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Cited by
Sorted by citations
Interface strengthening of a roll-bonded two-ply Al/Cu sheet by short annealing
Kim, M. J., Lee, K. S., Han, S. H., & Hong, S. I. (2021) · Materials Characterization · doi:10.1016/j.matchar.2021.111021 · Cited by 50
Solid-State Diffusion Welding of Commercial Aluminum Alloy with Pure Copper
Bedjaoui, W., Boumerzoug, Z., & Delaunois, F. (2022) · International Journal of Automotive and Mechanical Engineering · doi:10.15282/ijame.19.2.2022.09.0751 · Cited by 31
Elkjaer, A., Sørhaug, J. A., Ringen, G., Bjørge, R., & Grong, Ø. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.04.029 · Cited by 23
Han, Q., Cui, J., Fan, M., Zheng, Y., Ye, S., Guo, Y., Liu, C., & Han, E. (2026) · Aerospace Science and Technology · doi:10.1016/j.ast.2026.111707 · Cited by 14
Wu, Y., Zhao, J., Yu, L., & Gu, C. F. (2024) · Metals and Materials International · doi:10.1007/s12540-024-01640-w · Cited by 7
Metadata
- Authors
- Hua, F.-A., Song, H.-W., Sun, T., & Li, J.-P.
- Affiliations
- Northeastern University (CN)
- Venue
- Metals and Materials International
- Published
- 2019-06-26
- Volume
- 26
- Issue
- 3
- Pages
- 333-345
- ISSN
- 1225-9438 (ISSN-L)
- 1598-9623
- 2005-4149
- OpenAlex
- W2954212994
- Cited by
- 15
- References
- 23
- Citations by year
- 2026: 3 · 2025: 4 · 2024: 4 · 2022: 2 · 2021: 1 · 2020: 1
- FWCI
- 0.56
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Metals and Materials International (publishedVersion)
- Funders
- National Natural Science Foundation of China (51104141, 50971039)
- Fundamental Research Funds for the Central Universities (N170704015)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
- Keywords
- intermetallic compound growth kinetics, interdiffusion, roll bonding, Cu/Al interface, annealing, analytical model
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