Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current
Abstract
The effects of intermetallic compounds on the electrical and mechanical properties of bimetallic friction welded Al-Cu joints was studied. The formation and growth of intermetallic compounds was studied in the temperature ranges 200-525/spl deg/C. In addition, the effect of electrical current on the morphology and kinetics of formation of intermetallic compounds of bimetallic friction welded aluminum-copper joints was studied in the temperature ranges 200-500/spl deg/C that was realized by heating Al-Cu joints with an ac current of different intensities (400-1000 A). The contact resistance was found to increase linearly with the thickness of the intermetallics. The presence of an electrical field greatly accelerates the kinetics of formation of intermetallic phases and alters significantly their morphology. The growth kinetics of intermetallic phases under the influence of electrical current is much higher than that under diffusion annealing in furnace.>
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Previous studies have demonstrated that Al-Cu bimetallic welds have high resistance that can increase further from relatively short term exposure to temperatures above 150°C.
“Previous studies have demonstrated that Al-Cu bimetallic welds have high resistance that can increase further from relatively short term exposure to temperatures above 150 • C [11,12].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Most studies have not performed heat treatment ageing and the relative resistance increase metric was only identified in a few studies.
“As such, most studies have not performed heat treatment ageing and this metric was only identified in a few studies [11,12].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Several studies did not specify if bulk conductivity was measured, and in a few studies it was not measured or reported.
“Several studies did not specify if bulk conductivity was measured [11,12,28], and in a few studies it was not measured [30], or reported [13].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Braunovic & Alexandrov suggest possible explanations for the increased resistance as porosity, cracking, changes in grain sizes, and increased dislocation density across the interface.
“Braunovic & Alexandrov [12] suggest possible explanations for the increased resistance as porosity, cracking, changes in grain sizes, and increased dislocation density across the interface.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
200°C is an important operating condition that has previously limited the utility of welded Al-Cu conductors.
“We chose to show performance at 200 • C as it is an important operating condition that has previously limited the utility of welded Al-Cu conductors [12].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Braunovic pointed out that temperatures of 200°C and higher often occur in network overload conditions.
“Braunovic [12] has pointed out that temperatures of 200 • C and higher often occur in network overload conditions.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
The activation energy and pre-exponential constant for aluminum and copper interfaces have been reported for several processes.
“The activation energy and pre-exponential constant for aluminum and copper interfaces have been reported for several processes [11][12][13][14][15][16][17][18][19][20][21][42][43][44][45][46].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
A widely used criterion for the integrity of Al-Cu welds is maintaining a total thickness of intermetallic compounds below 2 μm.
“A widely used criterion for the integrity of Al-Cu welds is maintaining a total thickness of intermetallic compounds below 2 μm [11,12,31,40,47,48].”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Fig. 10 shows several studies have reported lower electrical resistance of friction welds since the highly cited Braunovic & Alexandrov characterisation.
“Therefore, it is worth highlighting that Fig. 10 shows several studies have reported lower electrical resistance of friction welds since the highly cited Braunovic & Alexandrov [12] characterisation.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [12]
Cited by
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Elkjaer, A., Sørhaug, J. A., Ringen, G., Bjørge, R., & Grong, Ø. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.04.029 · Cited by 23 · see citing works
Investigation of corrosion and electrical resistance in laser welded Al-Cu joints for EV batteries
Sinhmar, S., Mandal, S., Yadav, V. K., & Mondal, K. (2024) · Journal of Energy Storage · doi:10.1016/j.est.2024.114436 · Cited by 17 · see citing works
Sauter, L., Weihe, S., & Werz, M. (2026) · Results in Engineering · doi:10.1016/j.rineng.2026.111762 · Cited by 1 · see citing works
- Authors
- Braunovic, M., & Alexandrov, N.
- Affiliations
- Hydro-Québec (CA)
- Venue
- IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Published
- 1994-03
- Volume
- 17
- Issue
- 1
- Pages
- 78-85
- ISSN
- 1070-9886 (ISSN-L)
- OpenAlex
- W2109980475
- Cited by
- 169
- References
- 0
- Citations by year
- 2026: 12 · 2025: 6 · 2024: 14 · 2023: 3 · 2022: 6 · 2021: 7 · 2020: 14 · 2019: 9 · 2018: 9 · 2017: 9 · 2016: 8 · 2015: 8 · 2014: 8 · 2013: 3 · 2012: 6
- FWCI
- 0.00
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A (publishedVersion)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Electrical Contact Performance and Analysis
- Keywords
- intermetallic compounds, aluminum-copper joints, contact resistance, electrical current effects, intermetallic morphology, temperature effects, aluminum-copper dissimilar joining
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