Cited by 169Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesElectrical Contact Performance and Analysis

Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current

Braunovic, M., Alexandrov, N.·1994·IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A

Abstract

The effects of intermetallic compounds on the electrical and mechanical properties of bimetallic friction welded Al-Cu joints was studied. The formation and growth of intermetallic compounds was studied in the temperature ranges 200-525/spl deg/C. In addition, the effect of electrical current on the morphology and kinetics of formation of intermetallic compounds of bimetallic friction welded aluminum-copper joints was studied in the temperature ranges 200-500/spl deg/C that was realized by heating Al-Cu joints with an ac current of different intensities (400-1000 A). The contact resistance was found to increase linearly with the thickness of the intermetallics. The presence of an electrical field greatly accelerates the kinetics of formation of intermetallic phases and alters significantly their morphology. The growth kinetics of intermetallic phases under the influence of electrical current is much higher than that under diffusion annealing in furnace.>

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Crossref · 10.1109/95.296372

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Authors
Braunovic, M., & Alexandrov, N.
Affiliations
Hydro-Québec (CA)
Venue
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
Published
1994-03
Volume
17
Issue
1
Pages
78-85
ISSN
1070-9886 (ISSN-L)
OpenAlex
W2109980475
Cited by
169
References
0
Citations by year
2026: 12 · 2025: 6 · 2024: 14 · 2023: 3 · 2022: 6 · 2021: 7 · 2020: 14 · 2019: 9 · 2018: 9 · 2017: 9 · 2016: 8 · 2015: 8 · 2014: 8 · 2013: 3 · 2012: 6
FWCI
0.00
Type
journal article
Language
en
Open access
closed
Locations
IEEE Transactions on Components Packaging and Manufacturing Technology Part A (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Mechanical Engineering › Electrical Contact Performance and Analysis
Keywords
intermetallic compounds, aluminum-copper joints, contact resistance, electrical current effects, intermetallic morphology, temperature effects, aluminum-copper dissimilar joining

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