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Cited by 25Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties

The DOI matches its Crossref record.

Effect of heat treatment on the interfacial microstructure and properties of Cu-Al joints

Wang, Xue-Gang, Li, Xin-Geng, Yan, Feng-Jie, Wang, Cheng-Guo·2017·Welding in the World
DOI 10.1007/s40194-016-0393-x
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Crossref · 10.1007/s40194-016-0393-x

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Research works printed but not linked: 21

  1. Braunovic M (2007) Reliability of power connections. Journal of Zhejiang University Science A 8:343–356 · DOI
  2. Abbasi M, Karimi Taheri A, Salehi MT (2001) Growth rate of intermetallic compounds in Al Cu bimetal produced by cold roll welding process. J Alloys Compd 319:233–241 · DOI · Paper page
  3. Lee WB, Bang KS, Jung SB (2005) Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing. J Alloys Compd 390:212–219 · DOI · Paper page
  4. Braunovic M, Aleksandrov N (1992) Intermetallic compounds at aluminum-to-copper and copper-to-tin electrical interfaces. Proceeding of the 38th IEEE Holm Conference of Electrical Contacts 1.2:25–34
  5. Dixon CD, Nelson FG (1960) The effect of elevated temperature on flash-welded aluminum-copper joints. Trans AIEE II 78:491–495
  6. Braunovic M, Aleksandrov N (1993) Effect of electrical current on the morphology and kinetics of formation of intermetallic phases in bimetallic aluminum-copper joint. IEEE Trans. paper No. CHMT-93-10: 261–268 · DOI
  7. Chen CY, Chen HL, Hwang WS (2006) Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate. Mater Trans 47:1232–1239 · DOI
  8. Hug E, Bellido N (2011) Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires. Mater Sci Eng A 528:7103–7106 · DOI
  9. Sheng LY, Yang F, Xi TF, Lai C, Ye HQ (2011) Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling. Compos Part B 42:1468–1473 · DOI · Paper page
  10. Gueydan A, Domengès B, Hug E (2014) Study of the intermetallic growth in copper-clad aluminum wires after thermal aging. Intermetallics 50:34–42 · DOI · Paper page
  11. Hang CJ, Wang CQ, Mayer M, Tian YH, Zhou Y, Wang HH (2008) Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron Reliab 48:416–424 · DOI
  12. Xu H, Liu C, Silberschmidt VV, Pramana SS, White TJ, Chen Z, Acoff VL (2011) Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds. Acta Mater 59:5661–5673 · DOI
  13. Chen J, Lai YS, Wang YW, Kao CR (2011) Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding. Microelectron Reliab 51:125–129 · DOI · Paper page
  14. Honarpisheh M, Asemabadi M, Sedighi M (2012) Investigation of annealing treatment on the interfacial properties of explosive-welded Al/Cu/Al multilayer. Mater Des 37:122–127 · DOI
  15. Wallach ER, Davis GJ (1977) Mechanical properties of aluminum-copper solid-phase welds. Metals Technology 4:183–190 · DOI
  16. Ren HS, Xiong HP, Chen B, Pang SJ (2015) Vacuum brazing TiAl to Ti3Al using two Ti-base filler metals. Weld World 59:639–646 · DOI
  17. Sui Y, Luo H, Lv Y et al (2016) Influence of brazing technology on the microstructure and properties of YG20C cemented carbide and 16Mn steel joints. Weld World. doi: 10.1007/s40194-016-0374-0 · DOI
  18. Ji F, Xue SB, Lou JY, Lou YB, Wang SQ (2012) Microstructure and properties of Cu/Al joints brazed with Zn–Al filler metals. Trans Nonferrous Metals Soc China 22:281–287 · DOI
  19. Ji F, Xue SB, Dai W (2012) Reliability studies of Cu/Al joints brazed with Zn-Al-Ce filler metals. Mater Des 42:156–163 · DOI
  20. Xia C, Li Y, Puchkov UA, Gerasimov SA, Wang J (2008) Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al-Si filler metal. Vacuum 82:799–804 · DOI
  21. Shinozaki K, Koyama K (2007) Development of Al/Cu dissimilar brazing joint controlled form of intermetallic compound. Materials Science Forum (539–543): 4075–4080 · DOI

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Metadata

Authors
Wang, X.-G., Li, X.-G., Yan, F.-J., & Wang, C.-G.
Affiliations
Shandong University (CN)
Venue
Welding in the World
Publisher
Springer Science and Business Media LLC
Published
2016-11-07
Volume
61
Issue
1
Pages
187-196
ISSN
  • 0043-2288 (ISSN-L)
  • 1878-6669
DOI
10.1007/s40194-016-0393-x
OpenAlex
W2557204129
Cited by
25
References
0
Citations by year
2025: 4 · 2024: 1 · 2023: 1 · 2022: 4 · 2021: 3 · 2020: 4 · 2019: 3 · 2018: 4 · 2017: 1
FWCI
2.37
Type
journal article
Language
en
Open access
closed
Licence
www.springer.com/tdm (unspecified)
Locations
Welding in the World (publishedVersion)
Funders
  • State Grid Corporation of China (SGKJ[2010]14)
  • state grid corporaton of China (SGKJ[2010]14)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
Keywords
flash welding, interfacial microstructure, intermetallic compounds, Kirkendall voids, parabolic rate law, interfacial fracture, heat treatment, electrical stability, mechanical integrity

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