The DOI matches its Crossref record.
Thermal conductivity of some common cryostat materials between 0.05 and 2 K
Open accessAbstract
In order to design efficient low temperature devices, one must often know the thermal conductivity of materials from which the devices will be built. Other researchers have reported measurements on useful materials, but the thermal conductivity of many of the materials used by low temperature physicists at Cornell has not been published. The purpose of this work is to report the thermal conductivity of some of them.
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Locatelli et al. [9] and Olson [12] have previously reported the low-temperature thermal conductivity of Vespel SP-1 (up to 1 K) and SP-22 (up to 2 K).
“Locatelli et al. [9] and Olson [12] have previously reported the low-temperature thermal conductivity of Vespel SP-1 (up to 1 K) and SP-22 (up to 2 K).”
From Thermal conductivity of thermally-isolating polymeric and composite structural support materials between 0.3 and 4K (2008) · cites this paper as [12]
For SP-22, our results are in very good agreement with Olson [12] for temperatures below 1 K.
“For SP-22, our results are in very good agreement with Olson [12] for temperatures below 1 K.”
From Thermal conductivity of thermally-isolating polymeric and composite structural support materials between 0.3 and 4K (2008) · cites this paper as [12]
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No references could be resolved yet.
Research works printed but not linked: 6
- Locatelli, 1976, Cryogenics, 16, 374, 10.1016/0011-2275(76)90220-4 · DOI · Paper page
- Raychaudhuri, 1982, Solid State Commun, 44, 711, 10.1016/0038-1098(82)90589-0 · DOI
- Anderson, 1970, J Appl Phys, 41, 3648, 10.1063/1.1659486 · DOI
- Cahill, 1989, Phys Rev B, 40, 3254, 10.1103/PhysRevB.40.3254 · DOI
- Bychkov, 1981, Cryogenics, 21, 741, 10.1016/0011-2275(81)90219-8 · DOI
- Lou, 1976, Solid State Commun, 19, 335, 10.1016/0038-1098(76)91345-4 · DOI
Cited by
Sorted by citations
Runyan, M. C., & Jones, W. C. (2008) · Cryogenics · doi:10.1016/j.cryogenics.2008.06.002 · Cited by 47
“[9] and Olson [12] have previously reported the low–temperature thermal conductivity of Vespel SP–1 (up to 1 K) and SP–22 (up to 2 K).”
BackgroundMethodResultInfluential
Metadata
- Authors
- Olson, J. R.
- Affiliations
- Cornell University (US)
- Corresponding author
- Olson, J.R.
- ORCID
- Olson, J.R.
- Venue
- Cryogenics
- Publisher
- Elsevier BV
- Published
- 1993-07
- Volume
- 33
- Issue
- 7
- Pages
- 729-731
- ISSN
- 0011-2275 (ISSN-L)
- OpenAlex
- W2132417696
- Cited by
- 81
- References
- 0
- Citations by year
- 2026: 4 · 2025: 3 · 2024: 3 · 2022: 2 · 2021: 2 · 2020: 3 · 2019: 1 · 2018: 6 · 2017: 4 · 2016: 2 · 2014: 9 · 2013: 2 · 2012: 2
- FWCI
- 2.14
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- Cryogenics (publishedVersion, cc-by-nc-nd)
- Funders
- National Science Foundation
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Aerospace Engineering › Spacecraft and Cryogenic Technologies
- Physical Sciences › Materials Science › Metals and Alloys › Thermodynamic and Structural Properties of Metals and Alloys
- Keywords
- thermal conductivity, low-temperature physics, cryogenic materials, thermal insulation
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