The DOI matches its Crossref record; 10 of the 10 references it cites were found in a registry or an index.
Enhanced thermal conductivity of polymer composites filled with hybrid filler
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Citations
Cites
(2015) · AccessScience · doi:10.1036/1097-8542.689300 · Cited by 887
The Thermal and Electrical Conductivity of Two-Phase Systems
Nielsen, L. E. (1974) · Industrial & Engineering Chemistry Fundamentals · doi:10.1021/i160049a004 · Cited by 556
Thermal conductivity of particulate‐filled polymers
Nielsen, L. E. (1973) · Journal of Applied Polymer Science · doi:10.1002/app.1973.070171224 · Cited by 316
Compendium of Thermophysical Property Measurement Methods
(1992) · Springer eBooks · doi:10.1007/978-1-4615-3286-6 · Cited by 279
Plastic encapsulated microelectronics
PECHT, M. G., & Nguyen, L. T. (1995) · Cited by 157
Thermal conductivity of molding compounds for plastic packaging
Bujard, P., Kuhnlein, G., Ino, S., & Shiobara, T. (1994) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.335037 · Cited by 113
Improved thermal conductivity in microelectronic encapsulants
Procter, P. J., & Solc, J. (1991) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.105121 · Cited by 102
Transient thermal conductivity measurements: comparison of destructive and nondestructive techniques
Mathis, N. E. (2000) · High Temperatures-High Pressures · doi:10.1068/htwu289 · Cited by 41
Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)
Bujard, P., & Ansermet, J. (1989) · doi:10.1109/stherm.1989.76077 · Cited by 34
Recommended measurement techniques and practices
Maglić, K. D., CEZAIRLIYAN, A., & Pelet︠s︡kiĭ, V. Ė. (1992) · Plenum Press eBooks · Cited by 17
Cited by
Zhi, C., Bando, Y., Tang, C., Kuwahara, H., & Golberg, D. (2009) · Advanced Materials · doi:10.1002/adma.200900323 · Cited by 1,756
Rheology and applications of highly filled polymers: A review of current understanding
Rueda, M. M., Auscher, M.-C., Fulchiron, R., Périé, T., Martin, G., Sonntag, P., & Cassagnau, P. (2017) · Progress in Polymer Science · doi:10.1016/j.progpolymsci.2016.12.007 · Cited by 518
Mechanical properties of the hexagonal boron nitride monolayer: Ab initio study
Peng, Q., Ji, W., & De, S. (2012) · Computational Materials Science · doi:10.1016/j.commatsci.2011.12.029 · Cited by 444
Challenges of shape memory polymers: A review of the progress toward overcoming SMP's limitations
Rousseau, I. A. (2008) · Polymer Engineering & Science · doi:10.1002/pen.21213 · Cited by 431
Evaluation of nanoparticulate fillers for development of shape memory polyurethane nanocomposites
Gunes, I. S., Cao, F., & Jana, S. C. (2008) · Polymer · doi:10.1016/j.polymer.2008.03.021 · Cited by 255
Metadata
- Authors
- Lee, G.-W., Park, M., Kim, J., Lee, J. I., & Yoon, H. G.
- Venue
- Composites Part A: Applied Science and Manufacturing
- Publisher
- Elsevier BV
- Published
- 2006-05
- Volume
- 37
- Issue
- 5
- Pages
- 727-734
- ISSN
- 1359-835X (ISSN-L)
- OpenAlex
- W2010053394
- Cited by
- 819
- References
- 10
- FWCI
- 5.04
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Enhanced thermal conductivity of polymer composites filled with hybrid filler. https://app.cochat.ai/papers/10.1016/j.compositesa.2005.07.006
- The paper
- Lee, G.-W., Park, M., Kim, J., Lee, J. I., & Yoon, H. G. (2006). Enhanced thermal conductivity of polymer composites filled with hybrid filler. Composites Part A: Applied Science and Manufacturing. https://doi.org/10.1016/j.compositesa.2005.07.006
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
