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Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

He, Ziqiang, Yan, Yunfei, Zhang, Zhien·2021·Energy
DOI 10.1016/j.energy.2020.119223
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Abstract

Abstract The electronic equipment developing towards miniaturization and high integration is facing the danger of high heat flux and non-uniform temperature distribution which leads to the reduction of life and reliability of electronic devices. The micro heat sinks have gained significant attention in heat dissipation of electronic devices with a high heat flux due to its large heat transfer surface to volume ratio, compact structure and outstanding thermal performance. In this review, we present the advantages and shortcomings of thermal enhancement technologies in different structural micro heat sinks. Moreover, the non-uniform temperature distribution which includes the temperature rising along the flow direction and hotspots, especially, the random hotspot with high heat flux, has been the serious issues in the thermal management of electronic devices. They are the main challenges for the efficient operation and service life of electronic components. Thus, it is urgent to develop an effective and economic process in automatic adaptive cooling of random hotspots. The purpose of this article is to introduce the existing thermal enhancement technologies in micro heat sinks and the reduction of non-uniform temperature distribution. Finally, the barriers and challenges for the developments of thermal management of electronic devices by micro heat sinks are discussed, and the future directions of the research topic are provided.

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Research works printed but not linked: 200

  1. Mahajan, 2002, Emerging directions for packaging technologies, Intel Technol J, 6, 62
  2. Xie, 2011, Parametric study on heat transfer enhancement and pressure drop of an internal blade tip-wall with pin-fin arrays, Heat Mass Tran, 47, 45, 10.1007/s00231-010-0671-x · doi:10.1007/s00231-010-0671-x
  3. Guan, 2012, Numerical investigation on heat transfer of liquid flow at low Reynolds number in micro-cylinder-groups, Heat Mass Tran, 48, 1141, 10.1007/s00231-011-0956-8 · doi:10.1007/s00231-011-0956-8
  4. Xu G. Evaluation of a liquid cooling concept for high power processors. 23th Annual IEEE Semiconductor Thermal Measurement and Management Symposium 2007; 190–195. · doi:10.1109/stherm.2007.352422
  5. Chandratilleke, 2010, Heat transfer enhancement in microchannels with cross-flow synthetic jets, Int J Therm Sci, 49, 504, 10.1016/j.ijthermalsci.2009.09.004 · doi:10.1016/j.ijthermalsci.2009.09.004
  6. Lyu, 2019, Experimental investigation on convective heat transfer induced by piston-driven synthetic jet with a transmission pipe, Exp Therm Fluid Sci, 104, 26, 10.1016/j.expthermflusci.2019.02.003 · doi:10.1016/j.expthermflusci.2019.02.003
  7. Punch J., Walsh E., Grimes R., et al. Jets and rotary flows for single-phase liquid cooling: an overview of some recent experimental findings. 11th International Thermal, Mechanical and Multi-physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) 2010; 1–4. · doi:10.1109/esime.2010.5464505
  8. Chingulpitak, 2015, A review of the effect of flow directions and behaviors on the thermal performance of conventional heat sinks, Int J Heat Mass Tran, 81, 10, 10.1016/j.ijheatmasstransfer.2014.09.081 · doi:10.1016/j.ijheatmasstransfer.2014.09.081
  9. Sienski K., Eden R., Schaefer D. 3-D electronic interconnect packaging. IEEE Aerospace Applications Conference Proceedings 1996; 363–373. · doi:10.1109/aero.1996.495896
  10. Feng, 2020, Temperature uniformity enhancement and flow characteristics of embedded gradient distribution micro pin fin arrays using dielectric coolant for direct intra-chip cooling, Int J Heat Mass Tran, 156, 119675, 10.1016/j.ijheatmasstransfer.2020.119675 · doi:10.1016/j.ijheatmasstransfer.2020.119675
  11. Alihosseini, 2020, Effect of a micro heat sink geometric design on thermo-hydraulic performance: a review, Appl Therm Eng, 170, 114974, 10.1016/j.applthermaleng.2020.114974 · doi:10.1016/j.applthermaleng.2020.114974
  12. Zhao, 2020, A review on heat enhancement in thermal energy conversion and management using field synergy principle, Appl Energy, 257, 114974, 10.1016/j.apenergy.2019.113995 · doi:10.1016/j.apenergy.2019.113995
  13. Zheng, 2020, A review on single-phase convective heat transfer enhancement based on multi-longitudinal vortices in heat exchanger tubes, Appl Therm Eng, 164, 14475, 10.1016/j.applthermaleng.2019.114475 · doi:10.1016/j.applthermaleng.2019.114475
  14. Liang, 2019, Review of single-phase and two-phase nanofluid heat transfer in macro-channels and micro-channels, Int J Heat Mass Tran, 136, 324, 10.1016/j.ijheatmasstransfer.2019.02.086 · doi:10.1016/j.ijheatmasstransfer.2019.02.086
  15. Mohammadi, 2018, Review on heat and fluid flow in micro pin fin heat sinks under single-phase and two-phase flow conditions, Nanoscale Microscale Thermophys Eng, 22, 153, 10.1080/15567265.2018.1475525 · doi:10.1080/15567265.2018.1475525
  16. Kumar, 2018, A review of flow and heat transfer behaviour of nanofluids in micro channel heat sinks, Therm Sci Eng Prog, 8, 477, 10.1016/j.tsep.2018.10.004 · doi:10.1016/j.tsep.2018.10.004
  17. Naqiuddin, 2018, Overview of micro-channel design for high heat flux application, Renew Sustain Energy Rev, 82, 901, 10.1016/j.rser.2017.09.110 · doi:10.1016/j.rser.2017.09.110
  18. Ghani, 2017, Hydrothermal performance of microchannel heat sink: the effect of channel design, Int J Heat Mass Tran, 107, 21, 10.1016/j.ijheatmasstransfer.2016.11.031 · doi:10.1016/j.ijheatmasstransfer.2016.11.031
  19. Ghani, 2017, The effect of manifold zone parameters on hydrothermal performance of micro-channel heat sink: a review, Int J Heat Mass Tran, 109, 1143, 10.1016/j.ijheatmasstransfer.2017.03.007 · doi:10.1016/j.ijheatmasstransfer.2017.03.007
  20. Ganvir, 2017, Heat transfer characteristics in nanofluid—a review, Renew Sustain Energy Rev, 75, 451, 10.1016/j.rser.2016.11.010 · doi:10.1016/j.rser.2016.11.010
  21. Klank, 2002, PIV measurements in a microfluidic 3D-sheathing structure with three-dimensional flow behaviour, J Micromech Microeng, 12, 862, 10.1088/0960-1317/12/6/318 · doi:10.1088/0960-1317/12/6/318
  22. Hung, 2013, Thermal performance of porous microchannel heat sink: effects of enlarging channel outlet, Int Commun Heat Mass Tran, 48, 86, 10.1016/j.icheatmasstransfer.2013.08.001 · doi:10.1016/j.icheatmasstransfer.2013.08.001
  23. Hung, 2012, Effects of tapered-channel design on thermal performance of microchannel heat sink, Int Commun Heat Mass Tran, 39, 1342, 10.1016/j.icheatmasstransfer.2012.08.008 · doi:10.1016/j.icheatmasstransfer.2012.08.008
  24. Chai, 2016, Parametric study on thermal and hydraulic characteristics of laminar flow in microchannel heat sink with fan-shaped ribs on sidewalls – Part 3: performance evaluation, Int J Heat Mass Tran, 97, 1091, 10.1016/j.ijheatmasstransfer.2016.02.075 · doi:10.1016/j.ijheatmasstransfer.2016.02.075
  25. Chai, 2016, Parametric study on thermal and hydraulic characteristics of laminar flow in microchannel heat sink with fan-shaped ribs on sidewalls – Part 1: heat transfer, Int J Heat Mass Tran, 97, 1069, 10.1016/j.ijheatmasstransfer.2016.02.077 · doi:10.1016/j.ijheatmasstransfer.2016.02.077
  26. Chai, 2016, Parametric study on thermal and hydraulic characteristics of laminar flow in microchannel heat sink with fan-shaped ribs on sidewalls – Part 2: pressure drop, Int J Heat Mass Tran, 97, 1081, 10.1016/j.ijheatmasstransfer.2016.02.076 · doi:10.1016/j.ijheatmasstransfer.2016.02.076
  27. Chai, 2016, Numerical study of laminar flow and heat transfer in microchannel heat sink with offset ribs on sidewalls, Appl Therm Eng, 92, 32, 10.1016/j.applthermaleng.2015.09.071 · doi:10.1016/j.applthermaleng.2015.09.071
  28. Chai, 2018, Thermohydraulic performance of microchannel heat sinks with triangular ribs on sidewalls – Part 1: local fluid flow and heat transfer characteristics, Int J Heat Mass Tran, 127, 1124, 10.1016/j.ijheatmasstransfer.2018.08.114 · doi:10.1016/j.ijheatmasstransfer.2018.08.114
  29. Chai, 2019, Thermohydraulic performance of microchannel heat sinks with triangular ribs on sidewalls – Part 2: average fluid flow and heat transfer characteristics, Int J Heat Mass Tran, 128, 634, 10.1016/j.ijheatmasstransfer.2018.09.027 · doi:10.1016/j.ijheatmasstransfer.2018.09.027
  30. Xia, 2011, Effects of structural parameters on fluid flow and heat transfer in a microchannel with aligned fan-shaped reentrant cavities, Int J Therm Sci, 50, 411, 10.1016/j.ijthermalsci.2010.08.009 · doi:10.1016/j.ijthermalsci.2010.08.009
  31. Croce, 2007, Three-dimensional roughness effect on microchannel heat transfer and pressure drop, Int J Heat Mass Tran, 50, 5249, 10.1016/j.ijheatmasstransfer.2007.06.021 · doi:10.1016/j.ijheatmasstransfer.2007.06.021
  32. Chai, 2011, Numerical simulation of fluid flow and heat transfer in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall, Int Commun Heat Mass Tran, 38, 577, 10.1016/j.icheatmasstransfer.2010.12.037 · doi:10.1016/j.icheatmasstransfer.2010.12.037
  33. Zhai, 2014, Heat transfer in the microchannels with fan-shaped reentrant cavities and different ribs based on field synergy principle and entropy generation analysis, Int J Heat Mass Tran, 68, 224, 10.1016/j.ijheatmasstransfer.2013.08.086 · doi:10.1016/j.ijheatmasstransfer.2013.08.086
  34. Huang, 2017, Thermal performance and structure optimization for slotted microchannel heat sink, Appl Therm Eng, 115, 1266, 10.1016/j.applthermaleng.2016.09.131 · doi:10.1016/j.applthermaleng.2016.09.131
  35. Zhu, 2019, Performance comparison of wavy microchannel heat sinks with wavy bottom rib and side rib designs, Int J Therm Sci, 146, 106068, 10.1016/j.ijthermalsci.2019.106068 · doi:10.1016/j.ijthermalsci.2019.106068
  36. Wang, 2020, A new design of double-layered microchannel heat sinks with wavy microchannels and porous-ribs, J Therm Anal Calorim, 141, 547, 10.1007/s10973-020-09317-3 · doi:10.1007/s10973-020-09317-3
  37. Ermagan, 2018, Numerical investigation into the thermo-fluid performance of wavy microchannels with superhydrophobic walls, Int J Therm Sci, 132, 578, 10.1016/j.ijthermalsci.2018.06.035 · doi:10.1016/j.ijthermalsci.2018.06.035
  38. Chiam, 2016, Investigation of fluid flow and heat transfer in wavy micro-channels with alternating secondary branches, Int J Heat Mass Tran, 101, 1316, 10.1016/j.ijheatmasstransfer.2016.05.097 · doi:10.1016/j.ijheatmasstransfer.2016.05.097
  39. Koh, 1986, Heat transfer of microstructure for integrated circuits, Int Commun Heat Mass Tran, 13, 89, 10.1016/0735-1933(86)90075-8 · doi:10.1016/0735-1933(86)90075-8
  40. Gong, 2018, Thermal performance of micro-channel heat sink with metallic porous/solid compound fin design, Appl Therm Eng, 137, 288, 10.1016/j.applthermaleng.2018.03.065 · doi:10.1016/j.applthermaleng.2018.03.065
  41. Bayrak, 2019, Numerical investigation of the effects of geometric structure of microchannel heat sink on flow characteristics and heat transfer performance, Int J Therm Sci, 135, 589, 10.1016/j.ijthermalsci.2018.08.030 · doi:10.1016/j.ijthermalsci.2018.08.030
  42. Xia, 2015, Experimental and numerical study of fluid flow and heat transfer characteristics in microchannel heat sink with complex structure, Energy Convers Manag, 105, 848, 10.1016/j.enconman.2015.08.042 · doi:10.1016/j.enconman.2015.08.042
  43. Renfer, 2013, Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks, Int J Heat Mass Tran, 65, 33, 10.1016/j.ijheatmasstransfer.2013.05.066 · doi:10.1016/j.ijheatmasstransfer.2013.05.066
  44. Ghani, 2017, Heat transfer augmentation in a microchannel heat sink with sinusoidal cavities and rectangular ribs, Int J Heat Mass Tran, 108, 1969, 10.1016/j.ijheatmasstransfer.2017.01.046 · doi:10.1016/j.ijheatmasstransfer.2017.01.046
  45. Chai, 2013, Heat transfer enhancement in microchannel heat sinks with periodic expansion–constriction cross-sections, Int J Heat Mass Tran, 62, 741, 10.1016/j.ijheatmasstransfer.2013.03.045 · doi:10.1016/j.ijheatmasstransfer.2013.03.045
  46. Shi, 2019, Geometry parameters optimization for a microchannel heat sink with secondary flow channel, Int Commun Heat Mass Tran, 104, 89, 10.1016/j.icheatmasstransfer.2019.03.009 · doi:10.1016/j.icheatmasstransfer.2019.03.009
  47. Mohammed, 2011, Numerical simulation of heat transfer enhancement in wavy microchannel heat sink, Int Commun Heat Mass Tran, 38, 63, 10.1016/j.icheatmasstransfer.2010.09.012 · doi:10.1016/j.icheatmasstransfer.2010.09.012
  48. Vafai, 1999, Analysis of two-layered micro-channel heat sink concept in electronic cooling, Int J Heat Mass Tran, 42, 2287, 10.1016/S0017-9310(98)00017-9 · doi:10.1016/s0017-9310(98)00017-9
  49. Hung, 2012, Analysis of heat transfer characteristics of double-layered microchannel heat sink, Int J Heat Mass Tran, 55, 3090, 10.1016/j.ijheatmasstransfer.2012.02.038 · doi:10.1016/j.ijheatmasstransfer.2012.02.038
  50. Wong, 2013, Heat transfer of a parallel flow two-layered microchannel heat sink, Int Commun Heat Mass Tran, 49, 136, 10.1016/j.icheatmasstransfer.2013.09.004 · doi:10.1016/j.icheatmasstransfer.2013.09.004
  51. Wong, 2017, Thermal hydraulic performance of a double-layer microchannel heat sink with channel contraction, Int Commun Heat Mass Tran, 81, 269, 10.1016/j.icheatmasstransfer.2016.09.013 · doi:10.1016/j.icheatmasstransfer.2016.09.013
  52. Ghahremannezhad, 2019, Effect of porous substrates on thermohydraulic performance enhancement of double layer microchannel heat sinks, Int J Heat Mass Tran, 131, 52, 10.1016/j.ijheatmasstransfer.2018.11.040 · doi:10.1016/j.ijheatmasstransfer.2018.11.040
  53. Wan, 2012, Experimental analysis of flow and heat transfer in a miniature porous heat sink for high heat flux application, Int J Heat Mass Tran, 55, 4437, 10.1016/j.ijheatmasstransfer.2012.04.013 · doi:10.1016/j.ijheatmasstransfer.2012.04.013
  54. Wang, 2018, Flow and heat transfer characteristics in double-layered microchannel heat sinks with porous fins, Int Commun Heat Mass Tran, 93, 41, 10.1016/j.icheatmasstransfer.2018.03.003 · doi:10.1016/j.icheatmasstransfer.2018.03.003
  55. Li, 2019, Selected porous-ribs design for performance improvement in double-layered microchannel heat sinks, Int J Therm Sci, 137, 616, 10.1016/j.ijthermalsci.2018.12.029 · doi:10.1016/j.ijthermalsci.2018.12.029
  56. Leng, 2015, An improved design of double-layered microchannel heat sink with truncated top channels, Appl Therm Eng, 79, 54, 10.1016/j.applthermaleng.2015.01.015 · doi:10.1016/j.applthermaleng.2015.01.015
  57. Wu, 2014, Parametric study on the performance of double-layered microchannels heat sink, Energy Convers Manag, 80, 550, 10.1016/j.enconman.2014.01.014 · doi:10.1016/j.enconman.2014.01.014
  58. Shen, 2017, Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power, Appl Therm Eng, 121, 180, 10.1016/j.applthermaleng.2017.04.058 · doi:10.1016/j.applthermaleng.2017.04.058
  59. Hempijid, 2020, Effect of heat sink inlet and outlet flow direction on heat transfer performance, Appl Therm Eng, 164, 114375, 10.1016/j.applthermaleng.2019.114375 · doi:10.1016/j.applthermaleng.2019.114375
  60. Kumar, 2018, A new approach for the mitigating of flow maldistribution in parallel microchannel heat sink, J Heat Tran, 140
  61. Kumar, 2019, Numerical study on mitigation of flow maldistribution in parallel microchannel heat sink: channels variable width versus variable height approach, J Electron Packag, 141
  62. Liu, 2013, Effect of non-uniform heating on the performance of the microchannel heat sinks, Int Commun Heat Mass Tran, 43, 57, 10.1016/j.icheatmasstransfer.2013.02.003 · doi:10.1016/j.icheatmasstransfer.2013.02.003
  63. Wang, 2020, Optimization of a double-layered microchannel heat sink with semi-porous-ribs by multi-objective genetic algorithm, Int J Heat Mass Tran, 149, 119217, 10.1016/j.ijheatmasstransfer.2019.119217 · doi:10.1016/j.ijheatmasstransfer.2019.119217
  64. Xu, 2016, Optimization of the thermal performance of multilayer silicon microchannel heat sinks, Therm Sci, 20, 2001, 10.2298/TSCI141213122X · doi:10.2298/tsci141213122x
  65. Chong, 2002, Optimisation of single and double layer counter flow microchannel heat sinks, Appl Therm Eng, 22, 1569, 10.1016/S1359-4311(02)00083-2 · doi:10.1016/s1359-4311(02)00083-2
  66. Shao, 2012, Optimization and numerical simulation of multi-layer microchannel heat sink, Procedia Eng, 31, 928, 10.1016/j.proeng.2012.01.1123 · doi:10.1016/j.proeng.2012.01.1123
  67. Qu, 2002, Analysis of three-dimensional heat transfer in micro-channel heat sinks, Int J Heat Mass Tran, 45, 3973, 10.1016/S0017-9310(02)00101-1 · doi:10.1016/s0017-9310(02)00101-1
  68. Japar, 2018, A comprehensive study on heat transfer enhancement in microchannel heat sink with secondary channel, Int Commun Heat Mass Tran, 99, 62, 10.1016/j.icheatmasstransfer.2018.10.005 · doi:10.1016/j.icheatmasstransfer.2018.10.005
  69. Liu, 2011, Experimental study on liquid flow and heat transfer in micro square pin fin heat sink, Int J Heat Mass Tran, 54, 5602, 10.1016/j.ijheatmasstransfer.2011.07.013 · doi:10.1016/j.ijheatmasstransfer.2011.07.013
  70. Li, 2018, Flow and heat transfer characteristics and optimization study on the water-cooled microchannel heat sinks with dimple and pin-fin, Int J Heat Mass Tran, 119, 152, 10.1016/j.ijheatmasstransfer.2017.11.112 · doi:10.1016/j.ijheatmasstransfer.2017.11.112
  71. Li, 2020, Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink, Appl Therm Eng, 166, 114665, 10.1016/j.applthermaleng.2019.114665 · doi:10.1016/j.applthermaleng.2019.114665
  72. Xie, 2020, Research on the mechanism of heat transfer enhancement in microchannel heat sinks with micropin fins, Int J Energy Res, 44, 3049, 10.1002/er.5135 · doi:10.1002/er.5135
  73. Wang, 2018, Experimental and numerical study about local heat transfer in a microchannel with a pin fin, Int J Heat Mass Tran, 121, 534, 10.1016/j.ijheatmasstransfer.2018.01.034 · doi:10.1016/j.ijheatmasstransfer.2018.01.034
  74. Wan Z.M., Joshi Y. Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling. Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2014; 649–657. · doi:10.1109/itherm.2014.6892343
  75. Guan, 2016, Influence of heating load on heat transfer characteristics in micro-pin-fin arrays, Heat Mass Tran, 52, 393, 10.1007/s00231-015-1565-8 · doi:10.1007/s00231-015-1565-8
  76. Khoshvaght-Aliabadi, 2017, Experimental and parametric studies on a miniature heat sink with offset-strip pins and Al2O3/water nanofluids, Appl Therm Eng, 111, 1342, 10.1016/j.applthermaleng.2016.10.035 · doi:10.1016/j.applthermaleng.2016.10.035
  77. Kosar, 2005, Laminar flow across a bank of low aspect ratio micro pin fins, J Fluid Eng, 127, 419, 10.1115/1.1900139 · doi:10.1115/1.1900139
  78. Renfer, 2011, Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics, Exp Fluid, 51, 731, 10.1007/s00348-011-1091-5 · doi:10.1007/s00348-011-1091-5
  79. Chyu, 1990, Heat transfer and pressure drop for short pin-fin arrays with pin-endwall fillet, Am Soc Mech Eng, 112, 926
  80. Shafeie, 2013, Numerical study of heat transfer performance of single-phase heat sinks with micro pin-fin structures, Appl Therm Eng, 58, 68, 10.1016/j.applthermaleng.2013.04.008 · doi:10.1016/j.applthermaleng.2013.04.008
  81. Koşar, 2006, Thermal-hydraulic performance of MEMS-based pin fin heat sink, J Heat Tran, 128, 121
  82. İzci, 2015, The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heat sinks, Heat Tran Eng, 36, 1447, 10.1080/01457632.2015.1010921 · doi:10.1080/01457632.2015.1010921
  83. Sajedi, 2016, Splitter plate application on the circular and square pin fin heat sinks, Microelectron Reliab, 62, 91, 10.1016/j.microrel.2016.03.026 · doi:10.1016/j.microrel.2016.03.026
  84. Moores, 2003, Effect of tip clearance on the thermal and hydrodynamic performance of a shrouded pin fin array, J Heat Tran, 125, 999
  85. Chiu, 2017, The heat transfer characteristics of liquid cooling heat sink with micro pin fins, Int Commun Heat Mass Tran, 86, 174, 10.1016/j.icheatmasstransfer.2017.05.027 · doi:10.1016/j.icheatmasstransfer.2017.05.027
  86. Meis, 2010, Heat transfer enhancement in micro-channels caused by vortex promoters, Int J Heat Mass Tran, 53, 29, 10.1016/j.ijheatmasstransfer.2009.10.013 · doi:10.1016/j.ijheatmasstransfer.2009.10.013
  87. Woodrum D.C., Sarvey T., Bakir M.S., et al. Reliability study of micro-pin fin array for on-chip cooling. Electronic Components and Technology Conference 2015. · doi:10.1109/ectc.2015.7159922
  88. Hong, 2009, Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks, Int Commun Heat Mass Tran, 36, 651, 10.1016/j.icheatmasstransfer.2009.02.015 · doi:10.1016/j.icheatmasstransfer.2009.02.015
  89. Wan, 2017, Pressure drop and heat transfer characteristics of pin fin enhanced microgaps in single phase microfluidic cooling, Int J Heat Mass Tran, 115, 115, 10.1016/j.ijheatmasstransfer.2017.06.117 · doi:10.1016/j.ijheatmasstransfer.2017.06.117
  90. Reddy S.R., Abdoli A., Dulikravich G.S., et al. Multi-objective optimization of micro pin-fin arrays for cooling of high heat flux electronics with a hot spot. Proceedings of The ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (inter PACK2015) 2015;38:1235–1246. · DOI
  91. Moores, 2009, Heat transfer and fluid flow in shrouded pin fin arrays with and without tip clearance, Int J Heat Mass Tran, 52, 5978, 10.1016/j.ijheatmasstransfer.2009.08.005 · doi:10.1016/j.ijheatmasstransfer.2009.08.005
  92. Chang, 2008, Endwall heat transfer and pressure drop in rectangular channels with attached and detached circular pin-fin array, Int J Heat Mass Tran, 51, 5247, 10.1016/j.ijheatmasstransfer.2008.02.046 · doi:10.1016/j.ijheatmasstransfer.2008.02.046
  93. Roth, 2013, Heat transfer in freestanding microchannels with in-line and staggered pin fin structures with clearance, Int J Heat Mass Tran, 67, 1, 10.1016/j.ijheatmasstransfer.2013.07.097 · doi:10.1016/j.ijheatmasstransfer.2013.07.097
  94. Stephens, 2001, A pin fin microheat sink for cooling macroscale conformal surfaces under the influence of thrust and frictional forces, J MicroelectromecH S, 10, 222, 10.1109/84.925751 · doi:10.1109/84.925751
  95. He, 2020, Numerical study of thermal enhancement in a micro-heat sink with ribbed pin-fin arrays, J Therm Anal Calorim
  96. Awais, 2018, Heat transfer enhancement using different types of vortex generators (VGs): a review on experimental and numerical activities, Therm Sci Eng Prog, 5, 524, 10.1016/j.tsep.2018.02.007 · DOI
  97. Ortmanns, 2007, The effect of a single vortex generator jet on the characteristics of a turbulent boundary layer, Int J Heat Fluid Flow, 28, 1302, 10.1016/j.ijheatfluidflow.2007.06.006 · doi:10.1016/j.ijheatfluidflow.2007.06.006
  98. Sinha, 2013, Effects of different orientations of winglet arrays on the performance of plate-fin heat exchangers, Int J Heat Mass Tran, 57, 202, 10.1016/j.ijheatmasstransfer.2012.10.034 · doi:10.1016/j.ijheatmasstransfer.2012.10.034
  99. Chen, 2004, Flow structures and heat transfer characteristics in fan flows with and without delta-wing vortex generators, Exp Therm Fluid Sci, 28, 273, 10.1016/S0894-1777(03)00107-9 · doi:10.1016/s0894-1777(03)00107-9
  100. Fiebig, 1995, Numerical analysis of heat transfer and flow loss in a parallel plate heat exchanger element with longitudinal vortex generators as fins, J Heat Tran, 117, 1064
  101. Ma, 2010, Experimental investigations on single-phase heat transfer enhancement with longitudinal vortices in narrow rectangular channel, Nucl Eng Des, 240, 92, 10.1016/j.nucengdes.2009.10.015 · doi:10.1016/j.nucengdes.2009.10.015
  102. Lu, 2019, Analysis on heat transfer and pressure drop of a microchannel heat sink with dimples and vortex generators, Int J Therm Sci, 145, 105986, 10.1016/j.ijthermalsci.2019.105986 · doi:10.1016/j.ijthermalsci.2019.105986
  103. Chen, 2014, A study on fluid flow and heat transfer in rectangular microchannels with various longitudinal vortex generators, Int J Heat Mass Tran, 69, 203, 10.1016/j.ijheatmasstransfer.2013.10.018 · doi:10.1016/j.ijheatmasstransfer.2013.10.018
  104. Al-Asadi, 2018, Assessment of vortex generator shapes and pin fin perforations for enhancing water-based heat sink performance, Int Commun Heat Mass Tran, 91, 1, 10.1016/j.icheatmasstransfer.2017.11.002 · doi:10.1016/j.icheatmasstransfer.2017.11.002
  105. Liu, 2011, Experimental investigations on liquid flow and heat transfer in rectangular microchannel with longitudinal vortex generators, Int J Heat Mass Tran, 54, 3069, 10.1016/j.ijheatmasstransfer.2011.02.030 · doi:10.1016/j.ijheatmasstransfer.2011.02.030
  106. Mirzaee, 2012, Heat transfer enhancement in microchannels using an elastic vortex generator, J Enhanc Heat Transf, 19, 199, 10.1615/JEnhHeatTransf.2012002747 · doi:10.1615/jenhheattransf.2012002747
  107. Lu, 2019, Effects of curved vortex generators on the air-side performance of fin-and-tube heat exchangers, Int J Therm Sci, 136, 509, 10.1016/j.ijthermalsci.2018.11.009 · doi:10.1016/j.ijthermalsci.2018.11.009
  108. Zeeshan, 2018, Numerical investigation for the optimal placements of rectangular vortex generators for improved thermal performance of fin-and-tube heat exchangers, Appl Therm Eng, 136, 589, 10.1016/j.applthermaleng.2018.03.006 · doi:10.1016/j.applthermaleng.2018.03.006
  109. Song, 2018, The optimal arrangement of vortex generators for best heat transfer enhancement in flat-tube-fin heat exchanger, Int J Therm Sci, 132, 355, 10.1016/j.ijthermalsci.2018.06.011 · doi:10.1016/j.ijthermalsci.2018.06.011
  110. Samadifar, 2018, Numerical simulation of heat transfer enhancement in a plate-fin heat exchanger using a new type of vortex generators, Appl Therm Eng, 133, 671, 10.1016/j.applthermaleng.2018.01.062 · doi:10.1016/j.applthermaleng.2018.01.062
  111. Lu, 2018, Analysis on heat transfer and pressure drop of fin-and-oval-tube heat exchangers with tear-drop delta vortex generators, Int J Heat Mass Tran, 127, 1054, 10.1016/j.ijheatmasstransfer.2018.07.148 · doi:10.1016/j.ijheatmasstransfer.2018.07.148
  112. Dang, 2018, The performances of circular tube bank fin heat exchangers with fins punched with quadrilateral vortex generators and flow re-distributors, Appl Therm Eng, 134, 437, 10.1016/j.applthermaleng.2018.02.008 · doi:10.1016/j.applthermaleng.2018.02.008
  113. Wang, 2018, Parameterization investigation on the microchannel heat sink with slant rectangular ribs by numerical simulation, Appl Therm Eng, 133, 428, 10.1016/j.applthermaleng.2018.01.021 · doi:10.1016/j.applthermaleng.2018.01.021
  114. Al-Asadi, 2016, Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators, Int Commun Heat Mass Tran, 74, 40, 10.1016/j.icheatmasstransfer.2016.03.002 · doi:10.1016/j.icheatmasstransfer.2016.03.002
  115. Al-Asadi, 2018, Benefits of spanwise gaps in cylindrical vortex generators for conjugate heat transfer enhancement in micro-channels, Appl Therm Eng, 130, 571, 10.1016/j.applthermaleng.2017.10.157 · doi:10.1016/j.applthermaleng.2017.10.157
  116. Farzaneh, 2016, Design of bifurcating microchannels with/without loops for cooling of square-shaped electronic components, Appl Therm Eng, 108, 581, 10.1016/j.applthermaleng.2016.07.099 · doi:10.1016/j.applthermaleng.2016.07.099
  117. Tan, 2019, Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling, Int J Heat Mass Tran, 129, 681, 10.1016/j.ijheatmasstransfer.2018.09.092 · doi:10.1016/j.ijheatmasstransfer.2018.09.092
  118. Zhuang, 2020, Optimization of microchannel heat sink with rhombus fractal-like units for electronic chip cooling, Int J Refrig, 116, 108, 10.1016/j.ijrefrig.2020.03.026 · doi:10.1016/j.ijrefrig.2020.03.026
  119. Zhang, 2020, Topology optimization design of nanofluid-cooled microchannel heat sink with temperature-dependent fluid properties, Appl Therm Eng, 176, 115354, 10.1016/j.applthermaleng.2020.115354 · doi:10.1016/j.applthermaleng.2020.115354
  120. Zeng, 2020, Thermohydraulic analysis of a new fin pattern derived from topology optimized heat sink structures, Int J Heat Mass Tran, 147, 118909, 10.1016/j.ijheatmasstransfer.2019.118909 · doi:10.1016/j.ijheatmasstransfer.2019.118909
  121. Cao, 2020, Thermal performance of double serpentine minichannel heat sinks: effects of inlet-outlet arrangements and through-holes, Int J Heat Mass Tran, 153, 119575, 10.1016/j.ijheatmasstransfer.2020.119575 · doi:10.1016/j.ijheatmasstransfer.2020.119575
  122. Liu, 2020, Net-based topology optimization approach for cooling channels, Int J Therm Sci, 156, 106494, 10.1016/j.ijthermalsci.2020.106494 · doi:10.1016/j.ijthermalsci.2020.106494
  123. Skoura A., Barnathan M., Megalooikonomou V. Spatial feature extraction techniques for the analysis of ductal tree structures. 2009 Annual International Conference of the IEEE Engineering in Medicine and Biology Society 2009; 6620–6623. · doi:10.1109/iembs.2009.5332556
  124. Chen, 2005, An experimental investigation on the thermal efficiency of fractal tree-like microchannel nets, Int Commun Heat Mass Tran, 32, 931, 10.1016/j.icheatmasstransfer.2005.02.001 · doi:10.1016/j.icheatmasstransfer.2005.02.001
  125. Liu, 2007, Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips, Heat Mass Tran, 44, 221, 10.1007/s00231-007-0240-0 · doi:10.1007/s00231-007-0240-0
  126. Jing, 2019, Reexamination of Murray’s law for tree-like rectangular microchannel network with constant channel height, Int J Heat Mass Tran, 128, 1344, 10.1016/j.ijheatmasstransfer.2018.08.006 · doi:10.1016/j.ijheatmasstransfer.2018.08.006
  127. Bejan, 1998, Constructal theory: from thermodynamic and geometric optimization to predicting shape in nature, Energy Convers Manag, 39, 1705, 10.1016/S0196-8904(98)00054-5 · doi:10.1016/s0196-8904(98)00054-5
  128. Peng, 2019, Heat transfer and permeability of the tree-like branching networks, Int J Heat Mass Tran, 129, 801, 10.1016/j.ijheatmasstransfer.2018.09.121 · doi:10.1016/j.ijheatmasstransfer.2018.09.121
  129. Miguel, 2019, Optimal Y-shaped constructs heat sinks under different size constraints, Int J Heat Mass Tran, 131, 64, 10.1016/j.ijheatmasstransfer.2018.11.033 · doi:10.1016/j.ijheatmasstransfer.2018.11.033
  130. Jing, 2019, Comparison on the hydraulic and thermal performances of two tree-like channel networks with different size constraints, Int J Heat Mass Tran, 130, 1070, 10.1016/j.ijheatmasstransfer.2018.11.010 · doi:10.1016/j.ijheatmasstransfer.2018.11.010
  131. Xu, 2016, Global and local transport properties of steady and unsteady flow in a symmetrical bronchial tree, Int J Heat Mass Tran, 97, 696, 10.1016/j.ijheatmasstransfer.2016.02.068 · doi:10.1016/j.ijheatmasstransfer.2016.02.068
  132. Pence E, 2004, Inherent benefits in microscale fractal-like devices for enhanced transport phenomena, WIT Trans Ecol Environ, 73
  133. Pence, 2003, Reduced pumping power and wall temperature in microchannel heat sinks with fractal-like branching channel networks, Microscale Thermophys Eng, 6, 319, 10.1080/10893950290098359 · doi:10.1080/10893950290098359
  134. Lu, 2020, Effect of branching level on the performance of constructal theory based Y-shaped liquid cooling heat sink, Appl Therm Eng, 168, 114824, 10.1016/j.applthermaleng.2019.114824 · doi:10.1016/j.applthermaleng.2019.114824
  135. Xu, 2016, Characteristics of heat transfer and fluid flow in a fractal multilayer silicon microchannel, Int Commun Heat Mass Tran, 71, 86, 10.1016/j.icheatmasstransfer.2015.12.024 · doi:10.1016/j.icheatmasstransfer.2015.12.024
  136. Vilarrubí, 2018, Experimental and numerical study of micro-pin-fin heat sinks with variable density for increased temperature uniformity, Int J Therm Sci, 132, 424, 10.1016/j.ijthermalsci.2018.06.019 · doi:10.1016/j.ijthermalsci.2018.06.019
  137. Rubio-Jimenez, 2012, Numerical analysis of novel micro pin fin heat sink with variable fin density, IEEE Trans Compon Packag Manuf Technol, 2, 825, 10.1109/TCPMT.2012.2189925 · doi:10.1109/tcpmt.2012.2189925
  138. Xie, 2014, Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow, Appl Therm Eng, 62, 791, 10.1016/j.applthermaleng.2013.10.042 · doi:10.1016/j.applthermaleng.2013.10.042
  139. Feng, 2020, Heat transfer characteristics investigations on liquid-cooled integrated micro pin-fin chip with gradient distribution arrays and double heating input for intra-chip micro-fluidic cooling, Int J Heat Mass Tran, 159, 120118, 10.1016/j.ijheatmasstransfer.2020.120118 · doi:10.1016/j.ijheatmasstransfer.2020.120118
  140. Yan, 2019, Thermal-hydraulic performances and synergy effect between heat and flow distribution in a truncated doubled-layered heat sink with Y-shaped fractal network, Int J Heat Mass Tran, 142, 118337, 10.1016/j.ijheatmasstransfer.2019.06.093 · doi:10.1016/j.ijheatmasstransfer.2019.06.093
  141. Sharma, 2015, A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study, Int J Heat Mass Tran, 88, 684, 10.1016/j.ijheatmasstransfer.2015.04.047 · doi:10.1016/j.ijheatmasstransfer.2015.04.047
  142. Wang, 2015, Surface with recoverable mini structures made of shape-memory alloys for adaptive-control of boiling heat transfer, Appl Phys Lett, 107
  143. Drummond K.P., Weibel J.A., Garimella S.V., et al. Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array. 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016; 307–315. · doi:10.1109/itherm.2016.7517565
  144. Han Y., Lee Y.J., Lau B.L., et al. Thermal management of hotspots using upstream laminar micro-jet impinging array. 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) 2013; 83–87. · doi:10.1109/eptc.2013.6745689
  145. Lorenzini, 2016, Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering, Int J Heat Mass Tran, 103, 1359, 10.1016/j.ijheatmasstransfer.2016.08.040 · doi:10.1016/j.ijheatmasstransfer.2016.08.040
  146. Hu, 2017, Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array, Therm Thermomechanical Phenom in El Sys, 500
  147. Lee, 2013, Hotspot mitigating with obliquely finned microchannel heat sink—an experimental study, IEEE Trans Compon Packag Manuf Technol, 3, 1332, 10.1109/TCPMT.2013.2244164 · doi:10.1109/tcpmt.2013.2244164
  148. Lee Y.-J., Lee P.-S., Chou S.-K. Hot spot mitigating with oblique finned microchannel heat sink. Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE 2010) 2010; 167–174. · doi:10.1115/imece2010-37817
  149. Al-Waaly, 2017, Liquid cooling of non-uniform heat flux of a chip circuit by subchannels, Appl Therm Eng, 115, 558, 10.1016/j.applthermaleng.2016.12.061 · doi:10.1016/j.applthermaleng.2016.12.061
  150. Sharma, 2015, Energy efficient hotspot-targeted embedded liquid cooling of electronics, Appl Energy, 138, 414, 10.1016/j.apenergy.2014.10.068 · doi:10.1016/j.apenergy.2014.10.068
  151. Ansari, 2019, Hotspot management using a hybrid heat sink with stepped pin-fins, Numer Heat Tran, Part A: Applications, 75, 359, 10.1080/10407782.2019.1599272 · doi:10.1080/10407782.2019.1599272
  152. Ansari, 2018, Hotspot thermal management using a microchannel-pinfin hybrid heat sink, Int J Therm Sci, 134, 27, 10.1016/j.ijthermalsci.2018.07.043 · doi:10.1016/j.ijthermalsci.2018.07.043
  153. Green C., Fedorov A.G., Joshi Y.K. Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management. 11th Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems 2008; 510–519. · doi:10.1109/itherm.2008.4544311
  154. Ansari, 2020, A novel composite pinfin heat sink for hotspot mitigation, Int J Heat Mass Tran, 156, 119843, 10.1016/j.ijheatmasstransfer.2020.119843 · doi:10.1016/j.ijheatmasstransfer.2020.119843
  155. Jiang L., Koo J.-M., Wang E., et al. Cross-linked microchannels for VLSI hotspot cooling. Proceedings of IMECE 2002 International Mechanical Engineering Congress and Exposition (IMECE 2002) 2002; 13–17. · doi:10.1115/imece2002-39238
  156. Wang P, Bar-Cohen A, Yang B, et al. Thermoelectric micro-cooler for hot-spot thermal management. International Electronic Packaging Technical Conference and Exhibition 2005; 42002: 2161-2171. · doi:10.1115/ipack2005-73244
  157. Hao, 2016, Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink, Appl Therm Eng, 100, 170, 10.1016/j.applthermaleng.2016.01.131 · doi:10.1016/j.applthermaleng.2016.01.131
  158. Wang, 2007, On-chip hot spot cooling using silicon thermoelectric microcoolers, J Appl Phys, 102, 10.1063/1.2761839 · doi:10.1063/1.2761839
  159. Litvinovitch, 2010, Superlattice μTEC hot spot cooling, IEEE Trans Compon Packag Technol, 33, 229, 10.1109/TCAPT.2009.2032297 · doi:10.1109/tcapt.2009.2032297
  160. Wang, 2009, Mini-contact enhanced thermoelectric coolers for on-chip hot spot cooling, Heat Tran Eng, 30, 736, 10.1080/01457630802678391 · doi:10.1080/01457630802678391
  161. Bar-Cohen A. Thermal management of on-chip hot spots and 3D chip stacks. IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems 2009; 1–8. · doi:10.1109/comcas.2009.5385939
  162. Solbrekken G L. Peltier enhanced heat spreading for localized hot spot thermal management. International Electronic Packaging Technical Conference and Exhibition 2005; 42002: 2199-2205. · doi:10.1115/ipack2005-73471
  163. Li, 2014, Thermal-aware microchannel cooling of multicore processors: a three-stage design approach, J Electron Packag, 136
  164. Zhang Y, Li Y, Li X, et al. Strip-and-zone micro-channel liquid cooling of integrated circuits chips with non-uniform power distributions. Heat Transfer Summer Conference. American Society of Mechanical Engineers 2013; 55492: V003T10A007. · doi:10.1115/ht2013-17311
  165. Chauhan A., Sammakia B., Ghose K., et al. Hot spot mitigation using single-phase microchannel cooling for microprocessors. 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. IEEE 2010;1–11. · doi:10.1109/itherm.2010.5501357
  166. Xie, 2014, Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements, Int J Numer Methods Heat Fluid Flow, 24, 797, 10.1108/HFF-01-2013-0013 · doi:10.1108/hff-01-2013-0013
  167. Zhao, 2014, Design, fabrication and measurement of a microchannel heat sink with a pin-fin array and optimal inlet position for alleviating the hot spot effect, J Micromech Microeng, 24, 115013, 10.1088/0960-1317/24/11/115013 · doi:10.1088/0960-1317/24/11/115013
  168. Paik, 2008, Adaptive cooling of integrated circuits using digital microfluidics, IEEE Trans Very Large Scale Integr Syst, 16, 432, 10.1109/TVLSI.2007.915434 · doi:10.1109/tvlsi.2007.915434
  169. Hamann, 2007, Hotspot-limited microprocessors: direct temperature and power distribution measurements, IEEE J Solid State Circ, 42, 56, 10.1109/JSSC.2006.885064 · doi:10.1109/jssc.2006.885064
  170. Waddell, 2015, The heat transfer performance in a square channel downstream of a representative shape memory alloy structure for microfluidics applications, Thermal Measurement, Modeling and Management Symposium, 273
  171. Hussein, 2014, Study of forced convection nanofluid heat transfer in the automotive cooling system, Case Stud Therm Eng, 2, 50, 10.1016/j.csite.2013.12.001 · doi:10.1016/j.csite.2013.12.001
  172. Mudawar, 2009, Two-phase spray cooling of hybrid vehicle electronics, IEEE Trans Compon Packag Technol, 32, 501, 10.1109/TCAPT.2008.2006907 · doi:10.1109/tcapt.2008.2006907
  173. Radwan, 2018, Uniform cooling for concentrator photovoltaic cells and electronic chips by forced convective boiling in 3D-printed monolithic double-layer microchannel heat sink, Energy Convers Manag, 166, 356, 10.1016/j.enconman.2018.04.037 · doi:10.1016/j.enconman.2018.04.037
  174. Harb, 2020, Influence of varying the Ethylene-Vinyl Acetate layer thicknesses on the performance of a polycrystalline silicon solar cell integrated with a microchannel heat sink, Sol Energy, 195, 592, 10.1016/j.solener.2019.11.082 · doi:10.1016/j.solener.2019.11.082
  175. Lin, 2020, Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink, Appl Therm Eng, 172, 115165, 10.1016/j.applthermaleng.2020.115165 · doi:10.1016/j.applthermaleng.2020.115165
  176. Al Siyabi, 2020, Indoor and outdoor characterization of concentrating photovoltaic attached to multi-layered microchannel heat sink, Sol Energy, 202, 55, 10.1016/j.solener.2020.03.101 · doi:10.1016/j.solener.2020.03.101
  177. Aravind, 2018, Compact design of planar stepped micro combustor for portable thermoelectric power generation, Energy Convers Manag, 156, 224, 10.1016/j.enconman.2017.11.021 · doi:10.1016/j.enconman.2017.11.021
  178. Rezania, 2012, Thermal effect of a thermoelectric generator on parallel microchannel heat sink, Energy, 37, 220, 10.1016/j.energy.2011.11.043 · doi:10.1016/j.energy.2011.11.043
  179. He, 2012, A study on incorporation of thermoelectric modules with evacuated-tube heat-pipe solar collectors, Renew Energy, 37, 142, 10.1016/j.renene.2011.06.002 · doi:10.1016/j.renene.2011.06.002
  180. Sajid, 2017, An overview of cooling of thermoelectric devices, Renew Sustain Energy Rev, 78, 15, 10.1016/j.rser.2017.04.098 · doi:10.1016/j.rser.2017.04.098
  181. Niu, 2009, Experimental study on low-temperature waste heat thermoelectric generator, J Power Sources, 188, 621, 10.1016/j.jpowsour.2008.12.067 · doi:10.1016/j.jpowsour.2008.12.067
  182. Lv, 2018, Study of different heat exchange technologies influence on the performance of thermoelectric generators, Energy Convers Manag, 156, 167, 10.1016/j.enconman.2017.11.011 · doi:10.1016/j.enconman.2017.11.011
  183. Mudawar, 2009, Micro-channel heat exchangers for metal hydride hydrogen storage systems, US Provisional Patent Application, 61/184, 595
  184. Visaria, 2011, Enhanced heat exchanger design for hydrogen storage using high-pressure metal hydride – Part 2. Experimental results, Int J Heat Mass Tran, 54, 424, 10.1016/j.ijheatmasstransfer.2010.09.028 · doi:10.1016/j.ijheatmasstransfer.2010.09.028
  185. Xie, 2018, Simulation of loss-of-flow transient in water cooled fission blanket of Fusion-fission Hybrid Energy Reactor (FFHER), Fusion Eng Des, 127, 207, 10.1016/j.fusengdes.2017.12.039 · doi:10.1016/j.fusengdes.2017.12.039
  186. Nicholas, 2018, Development of a heat sink module for a near-term DEMO divertor, Fusion Eng Des, 133, 77, 10.1016/j.fusengdes.2018.05.070 · doi:10.1016/j.fusengdes.2018.05.070
  187. Deldar, 2019, Evaluation of water-cooled heat sink with complex designs of groove for application in fusion energy management, Fusion Eng Des, 140, 107, 10.1016/j.fusengdes.2019.01.149 · doi:10.1016/j.fusengdes.2019.01.149
  188. Gambier, 2009, Fusion for Energy: a new European organization for the development of fusion energy, Fusion Eng Des, 84, 138, 10.1016/j.fusengdes.2009.01.041 · doi:10.1016/j.fusengdes.2009.01.041
  189. Rajalingam, 2020, Effect of micro-structures in a microchannel heat sink – a comprehensive study, Int J Heat Mass Tran, 154, 119617, 10.1016/j.ijheatmasstransfer.2020.119617 · doi:10.1016/j.ijheatmasstransfer.2020.119617
  190. El-Masri, 1978, On the design of high-temperature gas turbine blade water-cooling channels, J Eng Power, 100, 586, 10.1115/1.3446400 · doi:10.1115/1.3446400
  191. Mudawwar, 1988, Boiling incipience in plane rotating water films, J Heat Tran, 110, 532
  192. Boyd, 2017, Subcooled flow boiling critical heat flux (CHF) and its application to fusion energy components. Part I. A review of fundamentals of CHF and related data base, Fusion Technol, 7, 7, 10.13182/FST85-A24515 · doi:10.13182/fst85-a24515
  193. Wang, 2006, Numerical simulation and optimization on heat transfer and fluid flow in cooling channel of liquid rocket engine thrust chamber, Eng Comput, 23, 907, 10.1108/02644400610707793 · doi:10.1108/02644400610707793
  194. Mudawar, 1994, Immersion-cooled standard electronic clamshell module: a building block for future high-flux avionic systems, J Electron Packag, 116, 116, 10.1115/1.2905499 · doi:10.1115/1.2905499
  195. Jimenez, 1994, A multi-kilowatt immersion-cooled standard electronic clamshell module for future aircraft avionics, J Electron Packag, 116, 220, 10.1115/1.2905689 · doi:10.1115/1.2905689
  196. Kim, 2015, Review of two-phase critical flow models and investigation of the relationship between choking, premature CHF, and CHF in micro-channel heat sinks, Int J Heat Mass Tran, 87, 497, 10.1016/j.ijheatmasstransfer.2015.04.012 · doi:10.1016/j.ijheatmasstransfer.2015.04.012
  197. Ellahi, 2016, The shape effects of nanoparticles suspended in HFE-7100 over wedge with entropy generation and mixed convection, Appl Nanosci, 6, 641, 10.1007/s13204-015-0481-z · doi:10.1007/s13204-015-0481-z
  198. Yang, 2011, Heat transfer and flow pattern characteristics for HFE-7100 within microchannel heat sinks, Heat Tran Eng, 32, 697, 10.1080/01457632.2010.509774 · doi:10.1080/01457632.2010.509774
  199. Neyestani, 2019, Thermal characteristics of CPU cooling by using a novel porous heat sink and nanofluids, J Therm Anal Calorim, 138, 805, 10.1007/s10973-019-08256-y · doi:10.1007/s10973-019-08256-y
  200. Junankar, 2020, A Review: enhancement of turning process performance by effective utilization of hybrid nanofluid and MQL, Mater Today: Proceedings

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Metadata

Authors
He, Z., Yan, Y., & Zhang, Z.
Venue
Energy
Publisher
Elsevier BV
Published
2021-02
Volume
216
Pages
119223
ISSN
0360-5442 (ISSN-L)
DOI
10.1016/j.energy.2020.119223
OpenAlex
W3095021497
Cited by
869
References
112
FWCI
34.28
Type
journal article
Language
en
Open access
closed
Licence
  • www.elsevier.com/tdm/userlicense/1.0/ (tdm)
  • www.elsevier.com/legal/tdmrep-license (tdm)
Funders
  • Natural Science Foundation of Chongqing
  • National Natural Science Foundation of China

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