Damage characterisation of tantalum ion source electrodes and reconditioning by wire-and powder-based laser metal deposition
Open accessAbstract
The internal ion source of the Advanced Molecular Image Technologies (AMIT) superconducting cyclotron uses cathodes made of pure tantalum to generate high energy H− ion beams for the production of isotopes for positron emission tomography. During service, the cathodes are impacted by high-energy ions from the plasma. The resulting erosion creates craters that reduce the current density of the extracted beam. The cathodes eventually need to be replaced when the ion source can no longer be activated. This research explores the possibility of repairing the tantalum cathodes used in the AMIT cyclotron through laser metal deposition additive manufacturing. The damaged parts were first characterised by 3D imaging, scanning electron microscopy, and Vickers microhardness to understand the damage mechanisms occurring during service and quantify the extent of the damage. Different repair strategies were then tested employing both high-purity tantalum wire and powder feedstocks and the properties of the reconditioned electrodes were determined. The ability of laser metal deposition to restore the damaged cathodes for use in the AMIT cyclotron has been demonstrated.
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WAAM relies on the presence of gases to create the electric arc, which seems impossible in a vacuum environment.
“However, WAAM relies on the presence of gases (typically shielding gases) to create the electric arc [305,306], which seems impossible in a vacuum environment.”
From A comprehensive review of lunar-based manufacturing and construction (2024) · cites this paper as [306]
The Introduction mentions WAAM as a method used to make tantalum components, but does not explain how its arc is created. Section 2.2 reports argon shielding gas for the paper’s laser metal deposition experiments, not for WAAM. Searches for WAAM, shielding gas, electric arcs, and vacuum found no passage addressing the claimed gas requirement or its feasibility in a vacuum. (LLM, conf=0.76)
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A comprehensive review of lunar-based manufacturing and construction
Azami, M., Kazemi, Z., Moazen, S., Dubé, M., Potvin, M.-J., & Skonieczny, K. (2024) · Progress in Aerospace Sciences · doi:10.1016/j.paerosci.2024.101045 · Cited by 57 · see citing works
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Additive manufacturing of superconductors: Opportunities and challenges
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- Authors
- Romano, T., Kroģere, D., Ratkus, A., Lauer, H., Marquardt, F., Vedani, M., Obradors, D., Weinmann, M., & Torims, T.
- Affiliations
- Riga Technical University (LV)
- Fraunhofer Institute for Material and Beam Technology (DE)
- Politecnico di Milano (IT)
- Centro de Investigaciones Energéticas, Medioambientales y Tecnológicas (ES)
- Corresponding author
- Romano, Tobia
- Venue
- International Journal of Refractory Metals and Hard Materials
- Publisher
- Elsevier BV
- Published
- 2023-11
- Volume
- 116
- Pages
- 106364
- ISSN
- 0263-4368 (ISSN-L)
- OpenAlex
- W4385856848
- Cited by
- 4
- References
- 42
- Citations by year
- 2025: 1 · 2024: 3
- FWCI
- 0.39
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Licence
- Locations
- International Journal of Refractory Metals and Hard Materials (publishedVersion, cc-by)
- SSRN Electronic Journal (acceptedVersion)
- Virtual Community of Pathological Anatomy (University of Castilla La Mancha) (submittedVersion, cc-by-nc-nd)
- Fraunhofer-Publica (Fraunhofer-Gesellschaft) (submittedVersion)
- Funders
- Horizon 2020 (101004730)
- European Commission
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Additive Manufacturing Materials and Processes
- Physical Sciences › Engineering › Mechanical Engineering › Surface Treatment and Coatings
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electrodeposition and Electroless Coatings
- Keywords
- tantalum cathode, laser metal deposition, additive manufacturing, erosion damage, Vickers microhardness, superconducting cyclotron, negative hydrogen ion beam, powder feedstock, wire feedstock
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