CoChat
Sign Up
Cited by 91Electronic Packaging and Soldering TechnologiesMetallurgical and Alloy ProcessesAdvanced Welding Techniques Analysis

The DOI matches its Crossref record.

Study of the intermetallic growth in copper-clad aluminum wires after thermal aging

Gueydan, Antoine, Domengès, Bernadette, Hug, Eric·2014·Intermetallics
DOI 10.1016/j.intermet.2014.02.007
Open this paper in CoChat — free account

Overview

Integrity signals

Registry

Crossref · 10.1016/j.intermet.2014.02.007

Cites

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

We couldn’t retrieve this paper’s full text, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Citations

Cites

No references could be resolved yet.

Research works printed but not linked: 45

  1. Bokshitskii, 1997, Structure and electrical properties of heat-resistant bimetallic conductors, Met Sci Heat Treat, 39, 38, 10.1007/BF02467210 · DOI
  2. Heness, 2008, Interfacial strength development of roll-bonded aluminium/copper metal laminates, Mater Sci Eng A, 483–484, 740, 10.1016/j.msea.2006.09.184 · DOI · Paper page
  3. Li, 2013, Effect of strain rate on tensile performance of Al/Cu/Al laminated composites produced by asymmetrical roll bonding, Mater Sci Eng A, 575, 61, 10.1016/j.msea.2013.03.056 · DOI
  4. Berski, 2006, Analysis of quality of bimetallic rod after extrusion process, J Mat Proc Techn, 177, 582, 10.1016/j.jmatprotec.2006.04.107 · DOI · Paper page
  5. Sapanathan, 2013, Spiral extrusion of aluminum/copper composite for future manufacturing of hybrid rods: a study of bond strength and interfacial characteristics, J Alloy Compd, 571, 85, 10.1016/j.jallcom.2013.03.210 · DOI
  6. Hang, 2008, Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging, Microelec Rel, 48, 416, 10.1016/j.microrel.2007.06.008 · DOI
  7. Braunovic, 1994, Intermetallic compounds at aluminium-to-copper electrical interfaces: effect of temperature and electric current, IEEE Trans Comp Pack Manufact Techn, 17, 78, 10.1109/95.296372 · DOI · Paper page
  8. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J Alloy Compd, 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  9. Rhee, 2004, Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics, Mater Sci Eng A, 384, 70, 10.1016/j.msea.2004.05.051 · DOI · Paper page
  10. Hug, 2011, Brittleness study of intermetallic (Cu,Al) layers in copper clad aluminium thin wires, Mater Sci Eng A, A528, 7103, 10.1016/j.msea.2011.05.077 · DOI
  11. Roberts-Austen, 1896, Gold, platinum, and rhodium diffusing in molten lead and in molten bismuth, Phil Trans R Soc Lond, 187, 383, 10.1098/rsta.1896.0010 · DOI
  12. Batt, 1964, Electron probe and X-ray diffraction measurements of intermediate phases in Zr diffused with Cr, Fe, Ni, Cu and Mo, J Nucl Mater, 13, 87, 10.1016/0022-3115(64)90070-4 · DOI
  13. Zhu, 2001, Stress aging of Al–Cu alloys: computer modeling, Acta Mater, 49, 3063, 10.1016/S1359-6454(01)00202-6 · DOI
  14. Mozetic, 1998, Self-controlled diffusion of Al in Cu thin film, Vacuum, 50, 1, 10.1016/S0042-207X(98)00016-5 · DOI
  15. Romanov, 1998, Coherent to incoherent transition in mismatched interfaces, Scr Mater, 38, 869, 10.1016/S1359-6462(97)00570-8 · DOI
  16. Pretorius, 1991, Prediction of phase formation sequence and phase stability in binary metal-aluminium thin film systems using the effective heat of formation rule, J Appl Phys, 70, 3636, 10.1063/1.349211 · DOI
  17. Phaneuf, 2005, FIB for materials science applications – a review, 143
  18. Yaguchi, 1999, Microsc Microanal, 5, 363, 10.1017/S1431927699000203 · DOI
  19. Oliver, 1992, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J Mater Res, 7, 1564, 10.1557/JMR.1992.1564 · DOI
  20. Delincé, 2006, Separation of size-dependent strengthening contributions in fine-grained dual phase steels by nanoindentation, Acta Mater, 54, 3395, 10.1016/j.actamat.2006.03.031 · DOI
  21. Hug, 2012, Nitriding aluminum alloys by N-multicharged ions implantation: correlation between surface strengthening and microstructure modifications, Surf Coat Technol, 206, 5028, 10.1016/j.surfcoat.2012.04.033 · DOI
  22. Witusievicz, 2004, J Alloy Compd, 385, 133
  23. Kisi, 1991, Ordering and structural vacancies in non-stoichiometric Cu–Al g brasses, Acta Crystallogr, B47, 835, 10.1107/S0108768191005694 · DOI
  24. Pearson, 1985
  25. Sasaki, 2010, Formation of ultra-fine copper grains in copper-clad aluminum wire, Scr Mater, 63, 488, 10.1016/j.scriptamat.2010.05.010 · DOI
  26. den Broeder, 1985, Diffusion-induced grain boundary migration and recrystallization, exemplified by the system Cu–Zn, Thin Solid Films, 124, 135, 10.1016/0040-6090(85)90256-1 · DOI
  27. Schwarz, 2003, Effects of diffusion induced recrystallization on volume diffusion in the copper–nickel system, Acta Mater, 51, 2765, 10.1016/S1359-6454(03)00082-X · DOI
  28. Beke, 2004, Diffusion-induced stresses and their relaxation, Mater Sci Eng a, 387–389, 4, 10.1016/j.msea.2004.01.065 · DOI
  29. Xu, 2011, Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds, Acta Mater, 59, 5661, 10.1016/j.actamat.2011.05.041 · DOI
  30. Ene, 2007, Solid state reaction in sandwich-type Al/Cu thin films, Ultramicroscopy, 107, 802, 10.1016/j.ultramic.2007.02.012 · DOI
  31. Abbasi, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J Alloy Compd, 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
  32. Laurila, 2000, Failure mechanism of Ta diffusion barrier between Cu and Si, J Appl Phys, 88, 3377, 10.1063/1.1288692 · DOI
  33. Kidson, 1961, Some aspects of the growth of diffusion layers in binary systems, J Nucl Mater, 3, 21, 10.1016/0022-3115(61)90175-1 · DOI · Paper page
  34. Saeid, 2010, Weldability and mechanical properties of dissimilar aluminum/copper lap joints made by friction stir welding, J Alloy Compd, 490, 652, 10.1016/j.jallcom.2009.10.127 · DOI
  35. Chen, 2007, Effect of annealing on the interfacial structure of aluminium–copper joints, Mater Trans, 48, 1938, 10.2320/matertrans.MER2006371 · DOI
  36. Mills, 1977, The heat capacity of Cu + Al alloys, J Chem Thermodyn, 9, 43, 10.1016/0021-9614(77)90195-1 · DOI
  37. Brown, 1980, Correlations for diffusion constants, Acta Metall, 24, 1088
  38. Dong, 2000, Al-Cu approximants and associated B2 chemical-twinning modes, Micron, 31, 507, 10.1016/S0968-4328(99)00131-6 · DOI
  39. Philibert, 1991, Reactive diffusion in thin films, Appl Surf Sci, 53, 74, 10.1016/0169-4332(91)90245-F · DOI
  40. Cooper, 1962, Precise lattice constants of germanium, aluminum, gallium, arsenide, uranium, sulphur, quartz and sapphire, Acta Crystallogr, 15, 578, 10.1107/S0365110X62001474 · DOI
  41. Havinga, 1972, Compounds and pseudo-binary alloys with the CuAl2 (c16)-type structure. II. Theoretical discussion of crystallographic parameters, J Less Common Met, 27, 187, 10.1016/0022-5088(72)90029-X · DOI
  42. El-Boragy, 1972, Kristallstruktur von Cu3Al2 + (h) und CuAl (r), J Less Common Met, 29, 133, 10.1016/0022-5088(72)90183-X · DOI
  43. Preston, 1931, An X-ray investigation of some copper–aluminum alloys, Philos Mag, 12, 980, 10.1080/14786443109461879 · DOI
  44. Arnberg, 1978, Crystal perfection in a noncentrosymmetric alloy. Refinement and test of twinning of the g-Cu9Al4 structure, Acta Crystallogr, A34, 399, 10.1107/S0567739478000807 · DOI
  45. Straumanis, 1969, Lattice parameters, densities, expansion coefficients and perfection of structure of Cu and of Cu-a phase, Acta Crystallogr, A25, 676, 10.1107/S0567739469001549 · DOI

Cited by

Sorted by citations

Metadata

Authors
Gueydan, A., Domengès, B., & Hug, E.
Affiliations
Centre National de la Recherche Scientifique (FR)
ORCID
Domengès, Bernadette
Venue
Intermetallics
Publisher
Elsevier BV
Published
2014-07
Volume
50
Pages
34-42
ISSN
0966-9795 (ISSN-L)
DOI
10.1016/j.intermet.2014.02.007
OpenAlex
W1972642585
Cited by
91
References
0
Citations by year
2026: 4 · 2025: 7 · 2024: 7 · 2023: 7 · 2022: 8 · 2021: 8 · 2020: 11 · 2019: 10 · 2018: 12 · 2017: 4 · 2016: 6 · 2015: 6 · 2014: 1
FWCI
3.01
Type
journal article
Language
en
Open access
closed
Locations
Intermetallics (publishedVersion)
Funders
Association Nationale de la Recherche et de la Technologie
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Materials Science › General Materials Science › Metallurgical and Alloy Processes
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
Keywords
intermetallic compound growth, solid-state diffusion, thermal aging, Al2Cu, AlCu, Al4Cu9, diffusion-induced recrystallization, copper-aluminum interface, annealing, interfacial microstructure

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review