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Cited by 60Advanced Welding Techniques AnalysisIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties

The DOI matches its Crossref record.

Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting

Li, Hanyan, Chen, Wenge, Dong, Longlong, Shi, Yingge, Liu, Jie, Fu, Yong Qing·2018·Journal of Materials Processing Technology
DOI 10.1016/j.jmatprotec.2017.10.050
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Crossref · 10.1016/j.jmatprotec.2017.10.050

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Research works printed but not linked: 24

  1. Berski, 2006, Analysis of quality of bimetallic rod after extrusion process, Mater. Process. Technol., 177, 582, 10.1016/j.jmatprotec.2006.04.107 · DOI · Paper page
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  3. Chen, 2016, Solidification process and microstructure of transition layer of Cu-Al composite cast prepared by method of pouring molten aluminum, Trans. Nonferrous Met. Soc. China, 26, 2247, 10.1016/S1003-6326(16)64343-1 · DOI
  4. Divandari, 2009, Study of Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process, Mater. Des., 30, 3279, 10.1016/j.matdes.2009.01.008 · DOI
  5. Dong, 2016, Metallurgical process analysis and microstructure characterization ofthe bonding interface of QAl9-4 aluminum bronze and 304 stainless steel composite materials, J. Mater. Process. Technol., 238, 325, 10.1016/j.jmatprotec.2016.07.041 · DOI
  6. Du, 2013, Effects of heat treatment on the Cu/Al composite interface, Trans. Mater. Heat Treatment, 33, 15
  7. Dubourg, 2002, Mechanical characterisation of laser surface alloyed aluminium-copper systems, Wear, 253, 1077, 10.1016/S0043-1648(02)00218-1 · DOI
  8. Hu, 2016, Study on microstructure and properties of Al/Cu bimetal in liquid Al-solid Cu compound casting process, Trans. Nonferrous Metals Soc. China, 26, 1555, 10.1016/S1003-6326(16)64261-9 · DOI · Paper page
  9. Hug, 2011, Brittleness study of intermetallic (Cu, A1) layers in copper clad aluminum thin wires, Mater. Sci. Eng. A, 528, 7103, 10.1016/j.msea.2011.05.077 · DOI
  10. Lee, 2013, Solid-state bonding between A1and Cu by vacuum hot pressing, Trans. Nonferrous Metals Soc. China, 23, 341, 10.1016/S1003-6326(13)62467-X · DOI
  11. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/A1 bimetallic joints during annealing, J. Alloys Compd., 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
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  13. Li, 2001, Numeric simulation of thickness of intermetallic compoundsin interface zone of diffusion bonding for Cu and Al, Trans. Nonferrous Metals Soc. China, 11, 908
  14. Ling, 2017, Fabrication of lateral compound Cu/Al composites by conclad continuous extrusion, Special Cast. Nonferrous Alloys, 37, 89
  15. Sun, 2001, Study of hot dipping aluminum coating and water-Based promotion flux, Plating, 21, 29
  16. Tanaka, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al, Mater. Sci. Eng. A, 445–446, 355, 10.1016/j.msea.2006.09.047 · DOI
  17. Wang, 1997, Bimetallic solid combination of research and development trend, China Mech. Eng., 8, 106
  18. Wang, 2014, Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography, J. Alloys Compd., 616, 550, 10.1016/j.jallcom.2014.07.172 · DOI
  19. Wang, 2015, Diffusion layer gowth kinetics model of copper hot-dippingaluminum coating, Funct. Mater., 2, 02080
  20. Zare, 2013, Investigation on interface of Al/Cu couples in compound casting, Mater. Sci. Technol., 29, 190, 10.1179/1743284712Y.0000000096 · DOI · Paper page
  21. Zhang, 2011, Effect of heat treatment on the interface of Al/Cu bimetal laminated material, Ordnance Mater. Sci. Eng., 34, 6
  22. Zhang, 2011, Interfacial microstructure evolution of copper/aluminium laminates with different annealing processes, Adv. Mater. Res., 239–242, 2976, 10.4028/www.scientific.net/AMR.239-242.2976 · DOI
  23. Zhang, 2014, Research progress of copper cladding aluminum composites, Chin. J. Nonferrous Metals, 24, 1276
  24. Zhao, 2011, Research progress on bonding mechanism and interface reaction of Cu/Al laminated composite, Hot Work. Technol., 40, 84

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Metadata

Authors
Li, H., Chen, W., Dong, L., Shi, Y., Liu, J., & Fu, Y. Q.
Affiliations
Xi'an University of Technology (CN)
Corresponding author
Chen, Wenge
ORCID
Venue
Journal of Materials Processing Technology
Publisher
Elsevier BV
Published
2018-02
Volume
252
Pages
795-803
ISSN
0924-0136 (ISSN-L)
DOI
10.1016/j.jmatprotec.2017.10.050
OpenAlex
W2766920759
Cited by
60
References
0
Citations by year
2026: 7 · 2025: 9 · 2024: 8 · 2023: 4 · 2022: 9 · 2021: 2 · 2020: 8 · 2019: 8 · 2018: 5
FWCI
4.46
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
  • Journal of Materials Processing Technology (publishedVersion)
  • Northumbria Research Link (Northumbria University) (acceptedVersion)
Funders
  • Key Research and Development Projects of Shaanxi Province (2017ZDXM-GY-050)
  • Electrical Materials and Infiltration Key Laboratory of Shaanxi Province Projects (No.17JS080)
  • Newton Mobility Grant (IE161019)
  • National Natural Science Foundation of China, and Royal academy of Engineering UK-Research Exchange with China and India
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
  • Physical Sciences › Engineering › Mechanical Engineering › Aluminum Alloys Composites Properties
Keywords
interfacial bonding, annealing, intermetallic compounds, CuAl2, CuAl, Cu9Al4, interdiffusion, graded microstructure, sintering, copper-aluminum interface, bond strength

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