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Microstructure and properties of Al/Cu bimetal in liquid−solid compound casting process
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In the citing paper
“This is also described in the investigations of Hu et al. [13].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“This is also described in the investigations of Hu et al. [13].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“Hu et al. also described the formation of cavities in their investigations as a result of material shrinkage [13].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“For example, Hu et al. showed the influence of casting time and temperature on the formation of the intermetallic phase thickness.They achieved the highest compound strengths for samples which exhibited the smallest intermetallic phase formation due to low thermal impact [13].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“They report an increase in phase thickness from 25 µm to 300 µm meant a loss in electrical conductivity from an initial 5.29 × 10 5 S/cm to 3.83 × 10 5 S/cm.”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“However, some studies show that excessively high growth in the intermetallic phase thickness, in turn, leads to a reduction in compound strength.”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“Similar investigations on compound casting processes show electrical conductivities of up to 5.29 × 10 5 (S/cm) [13].”
From Investigation of the Microstructure and Properties of Aluminum–Copper Compounds Fabricated by the High-Pressure Die Casting Process (2022) · cites this paper as [13]
In the citing paper
“Considering previous research, this lamellar eutectic structure was often witnessed at the interface of Al/Cu couples1,14,39.”
From Microstructural and mechanical characterization of Al/Cu interface in a bimetallic composite produced by compound casting (2024) · cites this paper as [1]
Citations
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No references could be resolved yet.
Research works printed but not linked: 35
- ACARER, 2012, Electrical, corrosion, and mechanical properties of aluminum–copper joints produced by explosive welding [J], Journal of Materials Engineering and Performance, 21, 2375, 10.1007/s11665-012-0203-6 · DOI
- ZHEN, 2009, Growth behavior of Al/Cu intermetallic compounds in hot-dip aluminized copper [J], Surface and Interface Analysis, 41, 361, 10.1002/sia.3020 · DOI
- LEE, 2007, Effects of annealing on the mechanical and interface properties of stainless steel/aluminum/copper clad–metal sheets [J], Journal of Materials Processing Technology, 187–188, 546, 10.1016/j.jmatprotec.2006.11.121 · DOI
- ZHAO, 2011, Research progress on bonding mechanism and interface reaction of Al/Cu laminated composite [J], Hot Working Technology, 40, 84
- SASAKE, 2010, Formation of ultra-fine copper grains in copper-clad aluminum wire [J], Scripta Materialia, 63, 488, 10.1016/j.scriptamat.2010.05.010 · DOI
- WANG, 2008, Microstructure and XRD analysis in the interface zone of Mg/Al diffusion bonding [J], Journal of Materials Processing Technology, 205, 146, 10.1016/j.jmatprotec.2007.11.096 · DOI
- RHEE, 2004, Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics [J], Materials Science and Engineering A, 384, 70, 10.1016/j.msea.2004.05.051 · DOI · Paper page
- ZHAO, 2014, Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal [J], Transactions of Nonferrous Metals Society of China, 24, 1659, 10.1016/S1003-6326(14)63238-6 · DOI
- CHEN C Y, HWANG W S. Effect of annealing on the interfacial structure of aluminum–copper joints [J]. Materials Transactions, 48(7): 1938–1947. · DOI
- ABBASI, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process [J], Journal of Alloys and Compounds, 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
- ABBASI, 2001, An investigation on cold roll welding of copper to aluminum using electrical resistivity [J], Zeitschrift fur Metallkunde, 92, 423
- SHENG, 2011, Influence of heat treatment on interface of Al/Cu bimetal composite fabricated by cold rolling [J], Composites: Part B, 42, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
- GUO, 2011, Intermetallic phase formation in diffusion-bonded Al/Cu laminates [J], Journal of Materials Science, 46, 2467, 10.1007/s10853-010-5093-0 · DOI
- CALVO, 1988, Special features of the formation of the diffusion bonded joints between copper and aluminium [J], Journal of Materials Science, 23, 2273, 10.1007/BF01115800 · DOI
- FENG, 2012, Microstructure and properties of Al/Cu joints brazed with Zn–Al filler metals [J], Transactions of Nonferrous Metals Society of China, 22, 281, 10.1016/S1003-6326(11)61172-2 · DOI
- JI, 2012, Reliability studies of Al/Cu joints brazed with Zn–Al–Ce filler metals [J], Materials & Design, 42, 156, 10.1016/j.matdes.2012.05.028 · DOI
- HENRYK, 2013, Microstructure and phase constitution near the interface of explosively welded aluminum/copper plates [J], Metallurgical and Materials Transactions A, 44, 3836, 10.1007/s11661-013-1703-1 · DOI
- GULENC, 2008, Investigation of interface properties and weldability of aluminum and copper plates by explosive welding method [J], Materials & Design, 29, 275, 10.1016/j.matdes.2006.11.001 · DOI
- ARITOSHI, 1992, Friction welding of oxygen free copper to pure aluminum [J], Welding International, 6, 853, 10.1080/09507119209548302 · DOI
- YILBAS, 1995, Friction welding of steel–Al and Al–Cu materials [J], Journal of Materials Processing Technology, 49, 431, 10.1016/0924-0136(94)01349-6 · DOI
- ZHANG, 2015, Microstructure and mechanical properties of dissimilar Al–Cu joints by friction stir welding [J], Transactions of Nonferrous Metals Society of China, 25, 1779, 10.1016/S1003-6326(15)63783-9 · DOI
- XUE, 2011, Effect of friction stir welding parameters on the microstructure and mechanical properties of the dissimilar Al–Cu joints [J], Materials Science and Engineering A, 528, 4683, 10.1016/j.msea.2011.02.067 · DOI
- SAEID, 2010, Weldability and mechanical properties of dissimilar aluminum–copper lap joints made by friction stir welding [J], Journal of Alloys and Compounds, 490, 652, 10.1016/j.jallcom.2009.10.127 · DOI
- PAPIS, 2009, Light metal compound casting [J], Science in China Series E: Technological Sciences, 52, 46, 10.1007/s11431-008-0345-9 · DOI
- ZARE, 2013, Investigation on interface of Al/Cu couples in compound casting [J], Materials Science and Technology, 29, 190, 10.1179/1743284712Y.0000000096 · DOI · Paper page
- HAJJARI, 2011, Dissimilar joining of Al/Mg light metals by compound casting process [J], Journal of Materials Science, 46, 6491, 10.1007/s10853-011-5595-4 · DOI
- TANAKA, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al [J], Materials Science and Engineering A, 445–446, 355, 10.1016/j.msea.2006.09.047 · DOI
- ZHANG, 2012, Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints [J], Materials Letters, 66, 113, 10.1016/j.matlet.2011.08.077 · DOI
- KUNDU, 2008, Characterization of diffusion bonded joint between titanium and 304 stainless steel using a Ni interlayer [J], Materials Characterization, 59, 631, 10.1016/j.matchar.2007.05.015 · DOI
- ZHANG, 2013, Effect of Al thin film and Ni foil interlayer on diffusion bonded Mg–Al dissimilar joints [J], Journal of Alloys and Compounds, 556, 139, 10.1016/j.jallcom.2012.12.106 · DOI · Paper page
- MALECKIA, 2000, Electroless nickel plating from acid bath [J], Surface and Coatings Technology, 123, 72, 10.1016/S0257-8972(99)00423-5 · DOI
- TANG, 2014, Electroless nickel plating on copper foil [J], Advanced Materials Research, 926, 103
- DAI, 2013, Electroless Ni–P coating on Cu substrate with strike nickel activation and its corrosion resistance [J], Materialwissenschaft und Werkstofftechnik, 44, 918, 10.1002/mawe.201300130 · DOI
- HO, 2014, Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system [J], Surface and Coatings Technology, 259, 244, 10.1016/j.surfcoat.2014.04.027 · DOI
- XU, 2014, Interfacial phenomena in magnesium/aluminum bi-metallic castings [J], Materials Science and Engineering A, 595, 154, 10.1016/j.msea.2013.11.093 · DOI
Cited by
Sorted by citations
Interfacial Microstructure Formation in Al7SiMg/Cu Compound Castings
Bakke, A. O., Løland, J.-O., Jørgensen, S., Kvinge, J., Arnberg, L., & Li, Y. (2021) · International Journal of Metalcasting · doi:10.1007/s40962-020-00463-w · Cited by 22
Bakke, A. O., Arnberg, L., & Li, Y. (2021) · Materials Science and Engineering: A · doi:10.1016/j.msea.2021.140979 · Cited by 20
Ahmadzadeh Salout, S., & Mirbagheri, S. M. H. (2024) · Scientific Reports · doi:10.1038/s41598-024-57849-7 · Cited by 18
Nolte, N., Lukasczyk, T., & Mayer, B. (2022) · Metals · doi:10.3390/met12081314 · Cited by 5
“They achieved the highest compound strengths for samples which exhibited the smallest intermetallic phase formation due to low thermal impact [13].”
BackgroundInfluentialZheng, H., Liu, C.-L., Gao, Q., Wu, M.-W., & Qin, X.-P. (2026) · Journal of Materials Research · doi:10.1557/s43578-025-01765-7 · Cited by 2
Metadata
- Authors
- HU, Y., CHEN, Y.-Q., LI, L., HU, H.-D., & ZHU, Z.-A.
- Affiliations
- Hefei University of Technology (CN)
- ORCID
- LI, Li
- Venue
- Transactions of Nonferrous Metals Society of China
- Publisher
- Elsevier BV
- Published
- 2016-06
- Volume
- 26
- Issue
- 6
- Pages
- 1555-1563
- ISSN
- 1003-6326 (ISSN-L)
- OpenAlex
- W2466819129
- Cited by
- 69
- References
- 0
- Citations by year
- 2026: 5 · 2025: 10 · 2024: 11 · 2023: 4 · 2022: 5 · 2021: 7 · 2020: 9 · 2019: 10 · 2018: 5 · 2017: 3
- FWCI
- 5.34
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Transactions of Nonferrous Metals Society of China (publishedVersion)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
- Keywords
- Ni-P coating, electroless plating, intermetallic compounds, Al2Cu phase, bonding temperature, preheating time, shear strength, electrical conductivity, diffusion barrier, aluminum-copper joints
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- This page
- CoChat. (2026). Citation check: Microstructure and properties of Al/Cu bimetal in liquid−solid compound casting process. https://app.cochat.ai/papers/10.1016/s1003-6326(16)64261-9
- The paper
- HU, Y., CHEN, Y.-Q., LI, L., HU, H.-D., & ZHU, Z.-A. (2016). Microstructure and properties of Al/Cu bimetal in liquid−solid compound casting process. Transactions of Nonferrous Metals Society of China. https://doi.org/10.1016/s1003-6326(16)64261-9
