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Cited by 73Advanced Welding Techniques AnalysisMicrostructure and mechanical propertiesElectronic Packaging and Soldering Technologies

The DOI matches its Crossref record.

Effects of annealing temperature on the interfacial microstructure and bonding strength of Cu/Al clad sheets produced by twin-roll casting and rolling

Mao, Zhiping, Xie, Jingpei, Wang, Aiqin, Wang, Wenyan, Ma, Douqin, Liu, Pei·2020·Journal of Materials Processing Technology
DOI 10.1016/j.jmatprotec.2020.116804
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Crossref · 10.1016/j.jmatprotec.2020.116804

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Research works printed but not linked: 24

  1. Bae, 2011, Cladding of Mg alloy with Al by twin-roll casting, Scripta Mater., 64, 836, 10.1016/j.scriptamat.2011.01.013 · DOI
  2. Baker, 1987, In-situ straining of Ni3Al in a transmission electron microscope, Acta Metall., 35, 1533, 10.1016/0001-6160(87)90098-8 · DOI
  3. Barekar, 2014, Twin-roll casting of aluminum alloys – an overview, Mater. Manuf. Processes, 29, 651, 10.1080/10426914.2014.912307 · DOI
  4. Chen, 2006, Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate, Mater. Trans., 47, 1232, 10.2320/matertrans.47.1232 · DOI
  5. Chen, 2016, Investigation on bonding strength of steel/aluminum clad sheet processed by horizontal twin-roll casting, annealing and cold rolling, Mater. Des., 112, 263, 10.1016/j.matdes.2016.09.061 · DOI
  6. Guo, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J. Mater, Sci., 46, 2467
  7. Hannech, 2003, Intermetallic formation in the aluminum-copper system, Surf. Rev. Lett., 10, 677, 10.1142/S0218625X03005396 · DOI
  8. Huang, 2017, Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip, T. Nonferr. Metals Soc., 27, 1019, 10.1016/S1003-6326(17)60119-5 · DOI · Paper page
  9. Kim, 2014, Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads, Acta Mater., 64, 356, 10.1016/j.actamat.2013.10.049 · DOI
  10. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J. Alloys. Compd., 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  11. Li, 2011, Interfacial microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding and annealing, Mater. Sci. Eng. A, 529, 485, 10.1016/j.msea.2011.09.087 · DOI · Paper page
  12. Li, 2018, Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting, J. Mater. Process. Technol., 252, 795, 10.1016/j.jmatprotec.2017.10.050 · DOI · Paper page
  13. Mao, 2018, Interfacial characterization and bonding properties of copper/aluminum clad sheets processed by horizontal twin-roll casting, multi-pass rolling, and annealing, Metals, 8, 645, 10.3390/met8080645 · DOI
  14. Mao, 2019, Interfacial microstructure and bonding strength of copper/aluminum clad sheets produced by horizontal twin-roll casting and annealing, Mater. Res. Express, 6
  15. Pelzer, 2012, High temperature storage reliability investigation of the Al-Cu wire bond interface, Microelectron. Reliab., 52, 1966, 10.1016/j.microrel.2012.06.070 · DOI
  16. Peng, 2000, Rolling strain effects on the interlaminar properties of roll bonded copper/aluminium metal laminates, J. Mater. Sci., 35, 4357, 10.1023/A:1004852806390 · DOI
  17. Sheng, 2011, Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Compos. Part B-Eng., 42, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
  18. Takasugi, 1985, Electronic and structural studies of grain boundary strength and fracture in L12 ordered alloys-I. On binary A3B alloys, Acta Metall., 33, 1247, 10.1016/0001-6160(85)90236-6 · DOI
  19. Tanaka, 2006, Evaluation of interdiffusion in liquid phase during reactive diffusion between Cu and Al, Mater. Trans., 47, 2480, 10.2320/matertrans.47.2480 · DOI
  20. Tanaka, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al, Mater. Sci. Eng. A, 445-446, 355, 10.1016/j.msea.2006.09.047 · DOI
  21. Tseng, 2009, An analysis of the formability of aluminum/copper clad metals with different thicknesses by the finite element method and experiment, Int. J. Adv. Manuf. Tech., 49, 1029, 10.1007/s00170-009-2446-4 · DOI
  22. Yasuhiro, 1971, Interdiffusion in the Al-Cu system, Trans. JIM, 12, 147, 10.2320/matertrans1960.12.147 · DOI
  23. Zhang, 2016, Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites, T. Nonferr. Metal Soc., 26, 3283, 10.1016/S1003-6326(16)64462-X · DOI
  24. Zu, 2017, Interfacial bonding mechanism and mechanical performance of Ti/steel bimetallic clad sheet produced by explosive welding and annealing, Rare Metal Mat. Engy., 46, 906, 10.1016/S1875-5372(17)30120-0 · DOI

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Metadata

Authors
Mao, Z., Xie, J., Wang, A., Wang, W., Ma, D., & Liu, P.
Affiliations
Henan University of Science and Technology (CN)
Corresponding author
Xie, Jingpei
ORCID
Venue
Journal of Materials Processing Technology
Publisher
Elsevier BV
Published
2020-11
Volume
285
Pages
116804
ISSN
0924-0136 (ISSN-L)
DOI
10.1016/j.jmatprotec.2020.116804
OpenAlex
W3034750202
Cited by
73
References
0
Citations by year
2026: 13 · 2025: 12 · 2024: 18 · 2023: 10 · 2022: 9 · 2021: 10 · 2020: 1
FWCI
3.60
Type
journal article
Language
en
Open access
closed
Licence
Locations
Journal of Materials Processing Technology (publishedVersion)
Funders
National Natural Science Foundation of China
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
Keywords
annealing temperature, interfacial microstructure, metallurgical bonding, peel strength, intermetallic compound layer, twin-roll casting, cold rolling, crack propagation, cleavage fracture

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