CoChat
Sign Up
Cited by 60Advanced Welding Techniques AnalysisIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties

The DOI matches its Crossref record.

Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting

Li, Hanyan, Chen, Wenge, Dong, Longlong, Shi, Yingge, Liu, Jie, Fu, Yong Qing·2018·Journal of Materials Processing Technology
DOI 10.1016/j.jmatprotec.2017.10.050
Open this paper in CoChat — free account

Overview

Integrity signals

Registry

Crossref · 10.1016/j.jmatprotec.2017.10.050

Cites

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

We couldn’t retrieve this paper’s full text, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Citations

Cites

No references could be resolved yet.

Research works printed but not linked: 24

  1. Berski, 2006, Analysis of quality of bimetallic rod after extrusion process, Mater. Process. Technol., 177, 582, 10.1016/j.jmatprotec.2006.04.107 · DOI · Paper page
  2. Chen, 2004, General theory of interdiffusion growth in diffusion couples, Mater. Sci. Eng., 368, 1, 10.1016/S0921-5093(03)00480-5 · DOI
  3. Chen, 2016, Solidification process and microstructure of transition layer of Cu-Al composite cast prepared by method of pouring molten aluminum, Trans. Nonferrous Met. Soc. China, 26, 2247, 10.1016/S1003-6326(16)64343-1 · DOI
  4. Divandari, 2009, Study of Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process, Mater. Des., 30, 3279, 10.1016/j.matdes.2009.01.008 · DOI
  5. Dong, 2016, Metallurgical process analysis and microstructure characterization ofthe bonding interface of QAl9-4 aluminum bronze and 304 stainless steel composite materials, J. Mater. Process. Technol., 238, 325, 10.1016/j.jmatprotec.2016.07.041 · DOI
  6. Du, 2013, Effects of heat treatment on the Cu/Al composite interface, Trans. Mater. Heat Treatment, 33, 15
  7. Dubourg, 2002, Mechanical characterisation of laser surface alloyed aluminium-copper systems, Wear, 253, 1077, 10.1016/S0043-1648(02)00218-1 · DOI
  8. Hu, 2016, Study on microstructure and properties of Al/Cu bimetal in liquid Al-solid Cu compound casting process, Trans. Nonferrous Metals Soc. China, 26, 1555, 10.1016/S1003-6326(16)64261-9 · DOI · Paper page
  9. Hug, 2011, Brittleness study of intermetallic (Cu, A1) layers in copper clad aluminum thin wires, Mater. Sci. Eng. A, 528, 7103, 10.1016/j.msea.2011.05.077 · DOI
  10. Lee, 2013, Solid-state bonding between A1and Cu by vacuum hot pressing, Trans. Nonferrous Metals Soc. China, 23, 341, 10.1016/S1003-6326(13)62467-X · DOI
  11. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/A1 bimetallic joints during annealing, J. Alloys Compd., 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  12. Li, 2009, Copper/aluminum interfacial intermetallics, J. Jiamusi Univ., 27, 556
  13. Li, 2001, Numeric simulation of thickness of intermetallic compoundsin interface zone of diffusion bonding for Cu and Al, Trans. Nonferrous Metals Soc. China, 11, 908
  14. Ling, 2017, Fabrication of lateral compound Cu/Al composites by conclad continuous extrusion, Special Cast. Nonferrous Alloys, 37, 89
  15. Sun, 2001, Study of hot dipping aluminum coating and water-Based promotion flux, Plating, 21, 29
  16. Tanaka, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al, Mater. Sci. Eng. A, 445–446, 355, 10.1016/j.msea.2006.09.047 · DOI
  17. Wang, 1997, Bimetallic solid combination of research and development trend, China Mech. Eng., 8, 106
  18. Wang, 2014, Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography, J. Alloys Compd., 616, 550, 10.1016/j.jallcom.2014.07.172 · DOI
  19. Wang, 2015, Diffusion layer gowth kinetics model of copper hot-dippingaluminum coating, Funct. Mater., 2, 02080
  20. Zare, 2013, Investigation on interface of Al/Cu couples in compound casting, Mater. Sci. Technol., 29, 190, 10.1179/1743284712Y.0000000096 · DOI · Paper page
  21. Zhang, 2011, Effect of heat treatment on the interface of Al/Cu bimetal laminated material, Ordnance Mater. Sci. Eng., 34, 6
  22. Zhang, 2011, Interfacial microstructure evolution of copper/aluminium laminates with different annealing processes, Adv. Mater. Res., 239–242, 2976, 10.4028/www.scientific.net/AMR.239-242.2976 · DOI
  23. Zhang, 2014, Research progress of copper cladding aluminum composites, Chin. J. Nonferrous Metals, 24, 1276
  24. Zhao, 2011, Research progress on bonding mechanism and interface reaction of Cu/Al laminated composite, Hot Work. Technol., 40, 84

Cited by

Sorted by citations

See all 60

Metadata

Authors
Li, H., Chen, W., Dong, L., Shi, Y., Liu, J., & Fu, Y. Q.
Affiliations
Xi'an University of Technology (CN)
Corresponding author
Chen, Wenge
ORCID
Venue
Journal of Materials Processing Technology
Publisher
Elsevier BV
Published
2018-02
Volume
252
Pages
795-803
ISSN
0924-0136 (ISSN-L)
DOI
10.1016/j.jmatprotec.2017.10.050
OpenAlex
W2766920759
Cited by
60
References
0
Citations by year
2026: 7 · 2025: 9 · 2024: 8 · 2023: 4 · 2022: 9 · 2021: 2 · 2020: 8 · 2019: 8 · 2018: 5
FWCI
4.46
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
  • Journal of Materials Processing Technology (publishedVersion)
  • Northumbria Research Link (Northumbria University) (acceptedVersion)
Funders
  • Key Research and Development Projects of Shaanxi Province (2017ZDXM-GY-050)
  • Electrical Materials and Infiltration Key Laboratory of Shaanxi Province Projects (No.17JS080)
  • Newton Mobility Grant (IE161019)
  • National Natural Science Foundation of China, and Royal academy of Engineering UK-Research Exchange with China and India
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
  • Physical Sciences › Engineering › Mechanical Engineering › Aluminum Alloys Composites Properties
Keywords
interfacial bonding, annealing, intermetallic compounds, CuAl2, CuAl, Cu9Al4, interdiffusion, graded microstructure, sintering, copper-aluminum interface, bond strength

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting. https://app.cochat.ai/papers/10.1016/j.jmatprotec.2017.10.050
The paper
Li, H., Chen, W., Dong, L., Shi, Y., Liu, J., & Fu, Y. Q. (2018). Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting. Journal of Materials Processing Technology. https://doi.org/10.1016/j.jmatprotec.2017.10.050