CoChat
Sign Up
Cited by 2

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Growth behavior of intermetallics with discontinuous distribution of Cu/Al/Cu trilayered composites during annealing

Cai, Huisheng, Yang, Siqi, Li, Jiyuan, Wang, Qudong, Zhao, Yuchao, jia, Qixiang, Ebrahimi, Mahmoud, Liu, Liang, Guo, Feng·2026·Journal of Materials Research and Technology
DOI 10.1016/j.jmrt.2026.03.280
Open this paper in CoChat — free account

Overview

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Integrity signals

Registry

Crossref · 10.1016/j.jmrt.2026.03.280

Cites

1 of 1 references verified0 citation errors · 0 not checkable

Statistics

Verification

Claims the paper makes

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

The self-check needs the paper’s full text.

Citations

Cites

Show all 1 references

Research works printed but not linked: 37

  1. Xing, 2022, Effect of electric current on formability and microstructure evolution of Cu/Al laminated composite, J Mater Res Technol, 21, 1128, 10.1016/j.jmrt.2022.09.077 · DOI
  2. Zhou, 2023, Microstructure characteristics and mechanical properties of Cu/Al laminated metal composites fabricated by electropulsing assisted ultrasonic additive manufacturing, J Mater Process Technol, 313, 10.1016/j.jmatprotec.2023.117884 · DOI
  3. Zheng, 2023, Fabrication of Cu/Al/Cu laminated composites reinforced with graphene by hot pressing and evaluation of their electrical conductivity, Materials, 16, 622, 10.3390/ma16020622 · DOI · Paper page
  4. Kunčická, 2019, Rotary swaged laminated Cu-Al composites: effect of structure on residual stress and mechanical and electric properties, Mater Sci Eng, A, 742, 743, 10.1016/j.msea.2018.11.026 · DOI
  5. Kocich, 2018, Characterization of innovative rotary swaged Cu-Al clad composite wire conductors, Materials and Design, 160, 828, 10.1016/j.matdes.2018.10.027 · DOI
  6. Jiang, 2022, Microstructure and texture distribution in the bonding interface of Cu/Al composite tube fabricated by explosive welding, Int J Adv Manuf Technol, 123, 3021, 10.1007/s00170-022-10371-4 · DOI
  7. Hanliang, 2022, Interface microstructure morphology and formation evolution mechanism of Al-1060/Cu-T2 composites fabricated by explosive welding method, Compos Interfaces, 29, 465, 10.1080/09276440.2021.1971883 · DOI
  8. Gao, 2021, Effects of a stainless steel interlayer on the interfacial microstructure and bonding strength of Cu/Al clad sheets prepared via the powder-in-tube method, J Mater Res Technol, 15, 3514, 10.1016/j.jmrt.2021.09.144 · DOI
  9. Khojastehnezhad, 2018, Microstructural characterization and mechanical properties of aluminum 6061-T6 plates welded with copper insert plate (Al/Cu/Al) using friction stir welding, Trans Nonferrous Met Soc China, 28, 415, 10.1016/S1003-6326(18)64675-8 · DOI
  10. Chang, 2020, Effects of asymmetry and annealing on interfacial microstructure and mechanical properties of Cu/Al laminated composite fabricated by asymmetrical roll bonding, J Alloys Compd, 815, 10.1016/j.jallcom.2019.152453 · DOI · Paper page
  11. Ren, 2024, Achieving excellent strength-elongation synergy in corrugated Cu/Al laminated composites by flat finish roll bonding, J Alloys Compd, 982, 10.1016/j.jallcom.2024.173782 · DOI
  12. Gao, 2023, Deformation behavior and bonding properties of Cu/Al laminated composite plate by corrugated cold roll bonding, J Mater Res Technol, 22, 3207, 10.1016/j.jmrt.2022.12.135 · DOI
  13. Goktasa, 2019, Mg doping levels and annealing temperature induced structural, optical and electrical properties of highly c-axis oriented zno:mg thin films and Al/ZnO:Mg/p-Si/Al heterojunction diode, Thin Solid Films, 680, 20, 10.1016/j.tsf.2019.04.024 · DOI
  14. Wang, 2023, Interface evolution and strengthening of two-step roll bonded copper/aluminum clad composites, Mater Char, 199, 10.1016/j.matchar.2023.112778 · DOI
  15. Han, 2023, Effect of annealing process on interface microstructure and mechanical property of the Cu/Al corrugated clad sheet, J Mater Res Technol, 23, 284, 10.1016/j.jmrt.2022.12.188 · DOI
  16. Zhao, 2024, The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C-800°C, Intermetallics, 168, 10.1016/j.intermet.2024.108244 · DOI
  17. Zhang, 2016, Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites, Trans Nonferrous Met Soc China, 26, 3283, 10.1016/S1003-6326(16)64462-X · DOI
  18. Yu, 2020, Interface microstructure and growth mechanism of brazing Cu/Al joint with BAl88Si filler metal, Vacuum, 181, 10.1016/j.vacuum.2020.109641 · DOI
  19. Guo, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J Mater Sci, 46, 2467, 10.1007/s10853-010-5093-0 · DOI
  20. Xing, 2020, Effect of annealing on the interface and mechanical properties of cu-al-cu laminated composite prepared with cold rolling, Materials, 13, 369, 10.3390/ma13020369 · DOI
  21. Cai, 2024, Shear behavior of Cu/Al/Cu trilayered composites prepared by high-temperature oxygen-free rolling, J Alloys Compd, 1004, 10.1016/j.jallcom.2024.175857 · DOI
  22. Wang, 2020, Sandwich-Like Cu/Al/Cu composites fabricated by cryorolling, Adv Eng Mater, 22, 10.1002/adem.202000122 · DOI
  23. Chen, 2023, Study on microstructure and properties of ultra-thin Cu/Al composite sheets using the cold-rolled composite method at the microscale, Metals, 13, 780, 10.3390/met13040780 · DOI
  24. Sadat Mousavi, 2016, A thermodynamic approach to predict Formation enthalpies of ternary systems based on Miedema's model, Metall Mater Trans, 47, 3761, 10.1007/s11661-016-3533-4 · DOI
  25. Biranvand, 2019, Thermodynamic study on the formation of order-disorder structure of the NiAl intermetallic compound by semi-empirical model, Phys B Condens Matter, 561, 43, 10.1016/j.physb.2019.02.050 · DOI
  26. Ray, 2010, Applications of an extended Miedema's model for ternary alloys, J Alloys Compd, 489, 357, 10.1016/j.jallcom.2009.07.062 · DOI
  27. Neves, 2020, Semi-empirical computational thermodynamic calculations used to predict carbide dissociation in Fe matrix, Mater Chem Phys, 240, 10.1016/j.matchemphys.2019.122313 · DOI
  28. Hsieh, 2012, Growth of intermetallic phases in Al/Cu composites at various annealing temperatures during the ARB process, Met Mater Int, 18, 1, 10.1007/s12540-012-0001-6 · DOI
  29. HengboMa, 2019, Growth characterization of intermetallic compounds at the Cu/Al solid state interface, Materials Research Express, 6
  30. Mirjalili, 2013, On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple, Intermetallics, 32, 297, 10.1016/j.intermet.2012.08.017 · DOI
  31. Amani, 2016, Intermetallic phase Formation in explosively welded Al/Cu bimetals, Metall Mater Trans B, 47, 2524, 10.1007/s11663-016-0682-1 · DOI
  32. Funamizu, 1971, Interdiffusion in the Al-Cu System, Transactions of the Japan Institute of Metals, 12, 147, 10.2320/matertrans1960.12.147 · DOI
  33. Chen, 2007, Effect of annealing on the interfacial structure of aluminum-copper joints, Mater Trans, 48, 1938, 10.2320/matertrans.MER2006371 · DOI
  34. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J Alloys Compd, 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  35. Han, 2023, Effect of annealing process on interface microstructure and mechanical property of the Cu/Al corrugated clad sheet, J Mater Res Technol, 23, 284, 10.1016/j.jmrt.2022.12.188 · DOI
  36. Adhami, 2025, Effect of annealing on the interface and microstructural properties of Al/Cu composites processed by hot pressing and subsequent cold rolling, J Mater Eng Perform, 34, 1840, 10.1007/s11665-024-09195-y · DOI
  37. Nishikawa, 2021, Effect of interfacial microstructure on mechanical properties of cold pressure-welded Al-Cu joints subjected to annealing, J Mater Eng Perform, 30, 7386, 10.1007/s11665-021-05970-3 · DOI

Metadata

Authors
Cai, H., Yang, S., Li, J., Wang, Q., Zhao, Y., jia, Q., Ebrahimi, M., Liu, L., & Guo, F.
Venue
Journal of Materials Research and Technology
Publisher
Elsevier BV
Published
2026-05
Volume
42
Pages
2596-2607
ISSN
2238-7854
DOI
10.1016/j.jmrt.2026.03.280
Cited by
2
References
1
Language
en
Licence
Funders
  • Shanghai Jiaotong University
  • National Key Research and Development Program of China (2021YFB3701303, YLXKZX-NGD-002)

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: Growth behavior of intermetallics with discontinuous distribution of Cu/Al/Cu trilayered composites during annealing. https://app.cochat.ai/papers/10.1016/j.jmrt.2026.03.280
The paper
Cai, H., Yang, S., Li, J., Wang, Q., Zhao, Y., jia, Q., Ebrahimi, M., Liu, L., & Guo, F. (2026). Growth behavior of intermetallics with discontinuous distribution of Cu/Al/Cu trilayered composites during annealing. Journal of Materials Research and Technology. https://doi.org/10.1016/j.jmrt.2026.03.280