The DOI matches its Crossref record; 23 of the 23 references it cites were found in a registry or an index.
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
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Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Hua et al. [16] have modelled the growth of intermetallic and shown that prediction of diffusion rates is improved by considering the unique concentration gradients across the weld.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [16]
In the citing paper
“Their findings indicate that the weld structure (i.e. the number of intermetallic compounds and constituent elements present along with the relative thickness ratios of the layers) will impact the overall diffusion rate.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [16]
Citations
Cites
Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process
Abbasi, M., Karimi Taheri, A., & Salehi, M. T. (2001) · Journal of Alloys and Compounds · doi:10.1016/s0925-8388(01)00872-6 · Cited by 433
Lee, W.-B., Bang, K.-S., & Jung, S.-B. (2005) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2004.07.057 · Cited by 368
Analysis of low-temperature intermetallic growth in copper-tin diffusion couples
Mei, Z., Sunwoo, A. J., & Morris, J. W., Jr. (1992) · Metallurgical Transactions A · doi:10.1007/bf02675563 · Cited by 252
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Kim, H.-J., Lee, J. Y., Paik, K., Koh, K.-W., Won, J., Choe, S. H., Lee, J., Moon, J. T., & Park, Y. (2003) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2003.815121 · Cited by 230
Intermetallic phase formation in diffusion-bonded Cu/Al laminates
Guo, Y., Liu, G., Jin, H., Shi, Z., & Qiao, G. (2010) · Journal of Materials Science · doi:10.1007/s10853-010-5093-0 · Cited by 208
Interdiffusion in the Al–Cu System
Funamizu, Y., & Watanabe, K. (1971) · Transactions of the Japan Institute of Metals · doi:10.2320/matertrans1960.12.147 · Cited by 195
Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints
Chen, C.-Y., & Hwang, W. (2007) · MATERIALS TRANSACTIONS · doi:10.2320/matertrans.mer2006371 · Cited by 185
Braunovic, M., & Alexandrov, N. (1994) · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · doi:10.1109/95.296372 · Cited by 169
Chen, C.-Y., Chen, H.-L., & Hwang, W. (2006) · MATERIALS TRANSACTIONS · doi:10.2320/matertrans.47.1232 · Cited by 162
On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
Peng, X., Wuhrer, R., Heness, G., & Yeung, W. Y. (1999) · Journal of Materials Science · doi:10.1023/a:1004543306110 · Cited by 108
Research works printed but not linked: 5
- L. Li, K. Nagai, F.X. Yin, Sci. Technol. Adv. Mater. 9, 1 (2008)
- S.Y. Chen, Z.W. Wu, K.X. Liu, J. Appl. Phys. 113, 1 (2013)
- D. Wang, Master Dissertation (Jiangxi University of Science and Technology, 2011) (in Chinese)
- Y.J. Guo, G.W. Liu, H.Y. Jin, Z.Q. Shi, G.J. Qiao, Rare Met. Mater. Eng. 41, 281 (2012)
- W. Jost, Diffusion in Solids, Liquids, and Gases, 2nd edn. (Academic, New York, 1960), p. 68
Cited by
Sorted by citations
Interface strengthening of a roll-bonded two-ply Al/Cu sheet by short annealing
Kim, M. J., Lee, K. S., Han, S. H., & Hong, S. I. (2021) · Materials Characterization · doi:10.1016/j.matchar.2021.111021 · Cited by 50
Solid-State Diffusion Welding of Commercial Aluminum Alloy with Pure Copper
Bedjaoui, W., Boumerzoug, Z., & Delaunois, F. (2022) · International Journal of Automotive and Mechanical Engineering · doi:10.15282/ijame.19.2.2022.09.0751 · Cited by 31
Elkjaer, A., Sørhaug, J. A., Ringen, G., Bjørge, R., & Grong, Ø. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.04.029 · Cited by 23
Han, Q., Cui, J., Fan, M., Zheng, Y., Ye, S., Guo, Y., Liu, C., & Han, E. (2026) · Aerospace Science and Technology · doi:10.1016/j.ast.2026.111707 · Cited by 14
Wu, Y., Zhao, J., Yu, L., & Gu, C. F. (2024) · Metals and Materials International · doi:10.1007/s12540-024-01640-w · Cited by 7
Metadata
- Authors
- Hua, F.-A., Song, H.-W., Sun, T., & Li, J.-P.
- Affiliations
- Northeastern University (CN)
- Venue
- Metals and Materials International
- Published
- 2019-06-26
- Volume
- 26
- Issue
- 3
- Pages
- 333-345
- ISSN
- 1225-9438 (ISSN-L)
- 1598-9623
- 2005-4149
- OpenAlex
- W2954212994
- Cited by
- 15
- References
- 23
- Citations by year
- 2026: 3 · 2025: 4 · 2024: 4 · 2022: 2 · 2021: 1 · 2020: 1
- FWCI
- 0.56
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Metals and Materials International (publishedVersion)
- Funders
- National Natural Science Foundation of China (51104141, 50971039)
- Fundamental Research Funds for the Central Universities (N170704015)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
- Keywords
- intermetallic compound growth kinetics, interdiffusion, roll bonding, Cu/Al interface, annealing, analytical model
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Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process. https://app.cochat.ai/papers/10.1007/s12540-019-00333-z
- The paper
- Hua, F.-A., Song, H.-W., Sun, T., & Li, J.-P. (2020). Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process. Metals and Materials International. https://doi.org/10.1007/s12540-019-00333-z
