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Cited by 101Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties

The DOI matches its Crossref record.

Controlling of IMCs layers formation sequence, bond strength and electrical resistance in Al Cu bimetal compound casting process

Tavassoli, Soheil, Abbasi, Mehrdad, Tahavvori, Ramin·2016·Materials & Design
DOI 10.1016/j.matdes.2016.06.076
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Crossref · 10.1016/j.matdes.2016.06.076

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Research works printed but not linked: 25

  1. Eizadjou, 2008, Investigation of structure and mechanical properties of multi-layered Al/Cu composite produced by accumulative roll bonding (ARB) process, Compos. Sci. Technol., 68, 2003, 10.1016/j.compscitech.2008.02.029 · DOI
  2. Khosravifard, 2010, Investigation of parameters affecting interface strength in Al/Cu clad bimetal rod extrusion process, Mater. Des., 31, 493, 10.1016/j.matdes.2009.06.026 · DOI · Paper page
  3. Xie J, Wu C, Liu X. A novel forming process of copper cladding aluminum composite materials with core-filling continuous casting. Mater. Sci. Forum 2007;539–543:956–961. · DOI
  4. Chen, 2005, Molecular dynamics modeling of diffusion bonding, Scr. Mater., 52, 1135, 10.1016/j.scriptamat.2005.02.004 · DOI
  5. Lee, 2013, Solid-state bonding between Al and Cu by vacuum hot pressing, Transactions of Nonferrous Metals, 23, 341, 10.1016/S1003-6326(13)62467-X · DOI
  6. Hug, 2011, Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminum thin wires, Mater. Sci. Eng., A528, 7103, 10.1016/j.msea.2011.05.077 · DOI
  7. Lee S, Lee MG, Lee SP, Lee GA, Kim YB, Lee JS, Bae DS. Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material. Trans. Nonferrous Metals Soc. China, 2012;22:s645−s649. · DOI
  8. Abbasi, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J. Alloys Compd., 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
  9. Sheng, 2011, Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Composites, 42Part B, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
  10. Chen, 2007, Effect of annealing on the interfacial structure of aluminum-copper joints, Mater. Trans., 48, 1938, 10.2320/matertrans.MER2006371 · DOI
  11. Kazanowski, 2004, Bimetal rod extrusion-process and product optimization, J. Mater. Sci. Eng., A369, 170, 10.1016/j.msea.2003.11.002 · DOI · Paper page
  12. Luo, 2012, Casting-cold extrusion of Al/Cu clad composite by copper tubes with different sketch section, J. Cent. S. Univ. Technol., 19, 882, 10.1007/s11771-012-1087-1 · DOI
  13. Mamalis, 1998, Fabrication of bimetallic rods by explosive cladding and warm extrusion, J. Mater. Process. Technol., 83, 48, 10.1016/S0924-0136(98)00042-9 · DOI
  14. Bereski, 2007, Quality of bimetallic Al-Cu joint after explosive cladding, Journal of achievement in materials, 22, 73
  15. Zare, 2013, Investigation on interface of Al/Cu couples in compound casting, Mater. Sci. Technol., 29, 190, 10.1179/1743284712Y.0000000096 · DOI · Paper page
  16. Papis, 2008, Interface formation in aluminium–aluminium compound casting, Acta Mater., 56, 3643, 10.1016/j.actamat.2008.02.042 · DOI
  17. Divandari, 2009, Study of Al/Cu rich phases formed in A356 alloy by inserting cu wire in pattern in LFC process, Mater. Des., 30, 3279, 10.1016/j.matdes.2009.01.008 · DOI
  18. Moreno, 1999, A technique for rapid characterization of intermetallics and interfaces, Intermetallics, 7, 1001, 10.1016/S0966-9795(99)00020-5 · DOI
  19. Liang, 2010, Research on continuous core-filling casting forming process of copper-clad aluminum bimetal composite material, Acta Metall. Sin., 23No.3, 206
  20. Xu, 2011, Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds, Acta Mater., 59, 5661, 10.1016/j.actamat.2011.05.041 · DOI
  21. Wei, 2015, Investigation of interdiffusion and intermetallic compounds in Al–Cu joint produced by continuous drive friction welding, Engineering Science and Technology, an International Journal
  22. Kim, 2014, Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads, Acta Mater., 64, 356, 10.1016/j.actamat.2013.10.049 · DOI
  23. Liu, 2016, An investigation into interface formation and mechanical properties of aluminum-copper bimetal by squeeze casting, Mater. Des., 5, 1137, 10.1016/j.matdes.2015.10.072 · DOI
  24. Honarpisheh, 2012, Investigation of annealing treatment on the interfacial properties of explosive-welded Al/Cu/Al multilayer, Mater. Des., 37, 122, 10.1016/j.matdes.2011.12.045 · DOI
  25. Tan, 2013, Microstructural evolution and mechanical properties of dissimilar Al–Cu joints produced by friction stir welding, Mater. Des., 51, 466, 10.1016/j.matdes.2013.04.056 · DOI · Paper page

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Metadata

Authors
Tavassoli, S., Abbasi, M., & Tahavvori, R.
Affiliations
Islamic Azad University, Karaj (IR)
Corresponding author
Abbasi, Mehrdad
ORCID
Abbasi, Mehrdad
Venue
Materials & Design
Publisher
Elsevier BV
Published
2016-10
Volume
108
Pages
343-353
ISSN
0264-1275 (ISSN-L)
DOI
10.1016/j.matdes.2016.06.076
OpenAlex
W2466585457
Cited by
101
References
0
Citations by year
2026: 10 · 2025: 15 · 2024: 9 · 2023: 15 · 2022: 14 · 2021: 6 · 2020: 9 · 2019: 4 · 2018: 9 · 2017: 10
FWCI
6.82
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
  • Materials & Design (publishedVersion)
  • DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Materials Science › Metals and Alloys › Aluminum Alloy Microstructure Properties
Keywords
compound casting, intermetallic compound layer, Cu/Al interface, bond strength, electrical conductivity, solid-state diffusion, Al2Cu, AlCu, Al4Cu9, eutectic microstructure

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