The DOI matches its Crossref record; 37 of the 37 references it cites were found in a registry or an index.
Interface microstructure evolution and mechanical properties of Al/Cu bimetallic tubes fabricated by a novel friction-based welding technology
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Although they have successfully produced two-layer aluminum-copper pipes by friction welding process, the main problem of their procedure is the impossibility of performing the process in producing pipes with long lengths and large diameters.”
From Theoretical and experimental studies on fabrication of two-layer aluminum−copper pipe by friction stir additive manufacturing (2021) · cites this paper as [29]
Citations
Cites
The role of annealing twins during recrystallization of Cu
Field, D. P., Bradford, L. H., Nowell, M. M., & Lillo, T. M. (2007) · Acta Materialia · doi:10.1016/j.actamat.2007.03.021 · Cited by 515
Murray, J. L. (1985) · International Materials Reviews · doi:10.1179/imr.1985.30.1.211 · Cited by 309
Pretorius, R., Vredenberg, A. M., Saris, F. W., & de Reus, R. (1991) · Journal of Applied Physics · doi:10.1063/1.349211 · Cited by 289
Murray, J. L. (1985) · International Metals Reviews · doi:10.1179/imtr.1985.30.1.211 · Cited by 275
Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds
Xu, H., Liu, C., Silberschmidt, V. V., Pramana, S. S., White, T. J., Chen, Z., & Acoff, V. L. (2011) · Acta Materialia · doi:10.1016/j.actamat.2011.05.041 · Cited by 252
Intermetallic phase formation in diffusion-bonded Cu/Al laminates
Guo, Y., Liu, G., Jin, H., Shi, Z., & Qiao, G. (2010) · Journal of Materials Science · doi:10.1007/s10853-010-5093-0 · Cited by 210
Borrisutthekul, R., Yachi, T., MIYASHITA, Y., & MUTOH, Y. (2007) · Materials Science and Engineering A · doi:10.1016/j.msea.2007.03.049 · Cited by 209
The effect of water cooling during dissimilar friction stir welding of Al alloy to Mg alloy
Mofid, M. A., Abdollah-Zadeh, A., & Ghaini, F. M. (2011) · Materials & Design (1980-2015) · doi:10.1016/j.matdes.2011.11.004 · Cited by 190
Yamamoto, N., Liao, J., Watanabe, S., & Nakata, K. (2009) · MATERIALS TRANSACTIONS · doi:10.2320/matertrans.m2009289 · Cited by 165
Zhang, J., Shen, Y., Yao, X., Xu, H., & Li, B. (2014) · Materials & Design (1980-2015) · doi:10.1016/j.matdes.2014.07.036 · Cited by 138
Research works printed but not linked: 2
- Ma, 2003, Some problems of copper using in air conditioning and refrigeration system, Refrig. Air Cond., 3, 66
- Tian, 2008, The research and application of copper clad aluminum tube, Chin. Nonferr. Metals, 7, 68
Cited by
FALAHATI NAQIBI, M., ELYASI, M., JAMSHIDI AVAL, H., & MIRNIA, M. J. (2021) · Transactions of Nonferrous Metals Society of China · doi:10.1016/s1003-6326(21)65754-0 · Cited by 20
Metadata
- Authors
- Li, W., Wen, Q., Yang, X., Wang, Y., Gao, D., & Wang, W.
- Affiliations
- Northwestern Polytechnical University (CN)
- Corresponding author
- Li, Wenya
- Venue
- Materials & Design
- Publisher
- Elsevier BV
- Published
- 2017-11
- Volume
- 134
- Pages
- 383-393
- ISSN
- 0264-1275 (ISSN-L)
- OpenAlex
- W2751770988
- Cited by
- 40
- References
- 37
- Citations by year
- 2025: 5 · 2024: 2 · 2023: 3 · 2022: 7 · 2021: 9 · 2020: 6 · 2019: 2 · 2018: 6
- FWCI
- 2.98
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Materials & Design (publishedVersion)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
- Funders
- Aviation Science Foundation (20161125002)
- 111 Project (B08040)
- National Key Research and Development Program of China (2016YFB0701203, 2016YFB1100104)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- interfacial microstructure, intermetallic compounds, Al2Cu, AlCu, solid-state diffusion, rotational speed, bonding mechanism, hardness, fracture behavior, crack propagation, metallurgical bonding
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
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Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
