The DOI matches its Crossref record; 37 of the 37 references it cites were found in a registry or an index.
Interface microstructure evolution and mechanical properties of Al/Cu bimetallic tubes fabricated by a novel friction-based welding technology
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“Although they have successfully produced two-layer aluminum-copper pipes by friction welding process, the main problem of their procedure is the impossibility of performing the process in producing pipes with long lengths and large diameters.”
From Theoretical and experimental studies on fabrication of two-layer aluminum−copper pipe by friction stir additive manufacturing (2021) · cites this paper as [29]
Citations
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Cited by
FALAHATI NAQIBI, M., ELYASI, M., JAMSHIDI AVAL, H., & MIRNIA, M. J. (2021) · Transactions of Nonferrous Metals Society of China · doi:10.1016/s1003-6326(21)65754-0 · Cited by 20
Metadata
- Authors
- Li, W., Wen, Q., Yang, X., Wang, Y., Gao, D., & Wang, W.
- Affiliations
- Northwestern Polytechnical University (CN)
- Corresponding author
- Li, Wenya
- Venue
- Materials & Design
- Publisher
- Elsevier BV
- Published
- 2017-11
- Volume
- 134
- Pages
- 383-393
- ISSN
- 0264-1275 (ISSN-L)
- OpenAlex
- W2751770988
- Cited by
- 40
- References
- 37
- Citations by year
- 2025: 5 · 2024: 2 · 2023: 3 · 2022: 7 · 2021: 9 · 2020: 6 · 2019: 2 · 2018: 6
- FWCI
- 2.98
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Materials & Design (publishedVersion)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
- Funders
- Aviation Science Foundation (20161125002)
- 111 Project (B08040)
- National Key Research and Development Program of China (2016YFB0701203, 2016YFB1100104)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- interfacial microstructure, intermetallic compounds, Al2Cu, AlCu, solid-state diffusion, rotational speed, bonding mechanism, hardness, fracture behavior, crack propagation, metallurgical bonding
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
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Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
