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Cited by 20Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesWelding Techniques and Residual Stresses

The DOI matches its Crossref record.

Joints formation and bonding mechanism of ultrasonic welded multi-strand single core copper cables with copper terminals

Ye, Fuxing, Lu, Hewan, Qi, Hang·2022·Materials Letters
DOI 10.1016/j.matlet.2022.133015
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Research works printed but not linked: 17

  1. Oliveira, 2019, J. Mater. Process Tech., 273, 10.1016/j.jmatprotec.2019.04.018 · DOI
  2. Yang, 2022, J. Mater. Process Tech., 301, 10.1016/j.jmatprotec.2021.117443 · DOI
  3. Fujimaki, 1993, J. Jpn. Weld Soc., 41, 277, 10.2207/qjjws.11.277 · DOI
  4. Fujimaki, 1995, Q. J. Jpn. Weld Soc., 13, 418, 10.2207/qjjws.13.418 · DOI
  5. Fujimaki, 1995, J. Jpn. Weld Soc., 13, 550, 10.2207/qjjws.13.550 · DOI
  6. Lu, 2022, J. Mater. Process., 78, 1
  7. Mostafavi, 2018, J. Mater. Process., 36, 104
  8. Mostafavi, 2019, J Mater Process., 41, 159
  9. Mostafavi, 2020, J. Mater. Process., 57, 893
  10. Zhang, 2018, Smart Mater. Struct., 27, 8
  11. Zhang, 2020, Scr. Mater., 178, 414, 10.1016/j.scriptamat.2019.12.012 · DOI
  12. Siddiq, 2011, Mater. Lett., 65, 356, 10.1016/j.matlet.2010.10.031 · DOI
  13. Fujii, 2017, Scr. Mater., 135, 125, 10.1016/j.scriptamat.2016.12.030 · DOI · Paper page
  14. Long, 2020, Mater. Des., 192, 10.1016/j.matdes.2020.108718 · DOI
  15. Xie, 2017, Mater. Charact., 132, 145, 10.1016/j.matchar.2017.06.018 · DOI
  16. Sriraman, 2010, Scr. Mater., 62, 560, 10.1016/j.scriptamat.2009.12.040 · DOI · Paper page
  17. Su, 2020, Metals., 11, 1, 10.3390/met11010061 · DOI

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Metadata

Authors
Ye, F., Lu, H., & Qi, H.
Affiliations
Tianjin University (CN)
Corresponding author
Ye, Fuxing
ORCID
Ye, Fuxing
Venue
Materials Letters
Publisher
Elsevier BV
Published
2022-11
Volume
327
Pages
133015
ISSN
0167-577X (ISSN-L)
DOI
10.1016/j.matlet.2022.133015
OpenAlex
W4292136255
Cited by
20
References
0
Citations by year
2026: 2 · 2025: 9 · 2024: 6 · 2023: 3
FWCI
1.70
Type
journal article
Language
en
Open access
closed
Licence
Locations
Materials Letters (publishedVersion)
Funders
  • National Major Science and Technology Projects of China (2017- VII -0007-0100)
  • National Natural Science Foundation of China (51975406)
  • National Key Research and Development Program of China (2018YFB1105804)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
Keywords
ultrasonic welding, copper cables, metallurgical bonding, joint formation, bonding mechanism, plastic deformation, dynamic recrystallization, dynamic recovery, fine-grained microstructure, T-peel strength

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CoChat. (2026). Citation check: Joints formation and bonding mechanism of ultrasonic welded multi-strand single core copper cables with copper terminals. https://app.cochat.ai/papers/10.1016/j.matlet.2022.133015
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Ye, F., Lu, H., & Qi, H. (2022). Joints formation and bonding mechanism of ultrasonic welded multi-strand single core copper cables with copper terminals. Materials Letters. https://doi.org/10.1016/j.matlet.2022.133015