The DOI matches its Crossref record; 156 of the 156 references it cites were found in a registry or an index.
Emerging challenges and materials for thermal management of electronics
Open accessAbstract
The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address some of these pressing thermal management challenges. In this paper a number of cubic crystals, two-dimensional layered materials, nanostructure networks and composites, molecular layers and surface functionalization, and aligned polymer structures are examined for potential applications as heat spreading layers and substrates, thermal interface materials, and underfill materials in future-generation electronics.
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Cited by
Zeng, X., Sun, J., Yao, Y., Sun, R., Xu, J.-B., & Wong, C.-P. (2017) · ACS Nano · doi:10.1021/acsnano.7b02359 · Cited by 523
Color Conversion Materials for High‐Brightness Laser‐Driven Solid‐State Lighting
Li, S., Wang, L., Hirosaki, N., & Xie, R. (2018) · Laser & Photonics Reviews · doi:10.1002/lpor.201800173 · Cited by 404
Thermal Transport in Conductive Polymer–Based Materials
Xu, X., Zhou, J., & Chen, J. (2020) · Advanced Functional Materials · doi:10.1002/adfm.201904704 · Cited by 224
Thermal conductivity of GaN, GaN71 , and SiC from 150 K to 850 K
Zheng, Q., Li, C., Rai, A., Leach, J. H., Broido, D. A., & Cahill, D. G. (2019) · Physical Review Materials · doi:10.1103/physrevmaterials.3.014601 · Cited by 177
High Thermal Boundary Conductance across Bonded Heterogeneous GaN—SiC Interfaces
Mu, F., Cheng, Z., Shi, J., Shin, S., Xu, B., Shiomi, J., Graham, S., & Suga, T. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.9b10106 · Cited by 159
Metadata
- Authors
- Moore, A. L., & Shi, L.
- Venue
- Materials Today
- Publisher
- Elsevier BV
- Published
- 2014-05
- Volume
- 17
- Issue
- 4
- Pages
- 163-174
- ISSN
- 1369-7021 (ISSN-L)
- OpenAlex
- W2033515476
- Cited by
- 2,106
- References
- 156
- FWCI
- 22.48
- Type
- journal article
- Language
- en
- Open access
- hybrid
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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