The DOI matches its Crossref record; 45 of the 45 references it cites were found in a registry or an index.
Asymmetric growth behavior of continuously distributed interfacial intermetallics and shear properties of Cu/Al/Cu laminated composites during annealing
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Citations
Cites
Molecular dynamics study of melting and freezing of small Lennard-Jones clusters
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Intermetallic phase formation in diffusion-bonded Cu/Al laminates
Guo, Y., Liu, G., Jin, H., Shi, Z., & Qiao, G. (2010) · Journal of Materials Science · doi:10.1007/s10853-010-5093-0 · Cited by 210
Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints
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On the kinetics of TiAl3 intermetallic layer formation in the titanium and aluminum diffusion couple
Mirjalili, M., Soltanieh, M., Matsuura, K., & Ohno, M. (2012) · Intermetallics · doi:10.1016/j.intermet.2012.08.017 · Cited by 151
Macwan, A., Jiang, X., Li, C., & Chen, D. L. (2013) · Materials Science and Engineering A · doi:10.1016/j.msea.2013.09.002 · Cited by 147
Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires
Hug, É., & Bellido, N. (2011) · Materials Science and Engineering A · doi:10.1016/j.msea.2011.05.077 · Cited by 131
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Research works printed but not linked: 16
- Guo, 2025, Research on the microstructure in the interface microzone and the synergistic strengthening mechanism of strength and plasticity of SiCp/Al-Cu laminated structure, J. Alloys Compd.
- Park, 2026, Molecular dynamics study of grain size effects on interfacial voids in Cu[sbnd]Cu diffusion bonding, Appl. Surf. Sci., 720
- Meguro, 2025, Elemental distribution at diffusion bonding interface of FeAlSi thermoelectric material and Cu, Weld. World, 1
- Liu, 2025, Fabrication of aluminum/steel bimetallic structures by low-temperature hot dipping, Int. J. Mech. Sci.
- Tian, 2025, Effect of annealing treatment on the interface structure and properties of 1070A/7075 composite plate produced by liquid-solid cast-rolling, Met. Sci. Heat Treat., 66, 1
- Zhang, 2025, Effect of post-deposition heat treatment on the 2024Al alloy produced by cold spray additive manufacturing, J. Phys. Conf., 3104, 10.1088/1742-6596/3104/1/012027 · DOI
- Juntao, 2020, Interfacial microstructure and shear strength of Cu/Al bimetal fabricated by diffusion welding, Rare Met. Mater. Eng., 49, 4121
- Lu, 2017, Behavior of interface phase growth of Cu/Al composite plate, Trans. Mater. Heat Treat., 38, 28
- Qing-Ling, 2015, In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bonding, Acta Phys. Sin., 64
- A T, 2022, LAMMPS - a flexible simulation tool for particle-based materials modeling at the atomic, meso, and continuum scales, Comput. Phys. Commun., 271
- Yajie, 2012, Growth behavior of intermetallic phase at diffusion bonded interface between copper and aluminium foil, Rare Met. Mater. Eng., 41, 281
- Chen, 2019, Interfacial intermetallic compounds growth law and thermal conductivity of Cu/Al clad sheet, Chin. J. Nonferrous Metals, 29, 906
- Guo, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J. Mater. Sci., 46, 2467, 10.1007/s10853-010-5093-0 · DOI
- HengboMa, 2019, Growth characterization of intermetallic compounds at the Cu/Al solid state interface, Mater. Res. Express, 6
- Amani, 2016, Intermetallic phase formation in explosively welded Al/Cu bimetals, Metall. Mater. Trans. B, 47, 2524, 10.1007/s11663-016-0682-1 · DOI
- Jiao-dong, 2003, Experimental study on diffusion bonding of Al-Cu bimetal composite structure, J. Mater. Eng., 34
Metadata
- Authors
- Yang, S., Xue, M., Li, J., He, Y., Lei, D., Wang, Q., Jia, Q., Liu, L., Su, J., Guo, F., & Cai, H.
- Venue
- Materials Science and Engineering: A
- Publisher
- Elsevier BV
- Published
- 2026-10
- Volume
- 973
- Pages
- 150760
- ISSN
- 0921-5093
- Cited by
- 1
- References
- 45
- Language
- en
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- www.elsevier.com/legal/tdmrep-license (tdm)
- doi.org/10.15223/policy-017 (stm-asf)
- doi.org/10.15223/policy-037 (stm-asf)
- doi.org/10.15223/policy-012 (stm-asf)
- doi.org/10.15223/policy-029 (stm-asf)
- doi.org/10.15223/policy-004 (stm-asf)
- Funders
- Ministry of Science and Technology of the People's Republic of China
- Department of Education of Inner Mongolia Autonomous Region
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- The paper
- Yang, S., Xue, M., Li, J., He, Y., Lei, D., Wang, Q., Jia, Q., Liu, L., Su, J., Guo, F., & Cai, H. (2026). Asymmetric growth behavior of continuously distributed interfacial intermetallics and shear properties of Cu/Al/Cu laminated composites during annealing. Materials Science and Engineering: A. https://doi.org/10.1016/j.msea.2026.150760
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
