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Asymmetric growth behavior of continuously distributed interfacial intermetallics and shear properties of Cu/Al/Cu laminated composites during annealing

Yang, Siqi, Xue, Monan, Li, Jiyuan, He, Yulong, Lei, Dengyun, Wang, Qudong, Jia, Qixiang, Liu, Liang, Su, Juan, Guo, Feng, Cai, Huisheng·2026·Materials Science and Engineering: A

DOI 10.1016/j.msea.2026.150760

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Authors: Yang, S., Xue, M., Li, J., He, Y., Lei, D., Wang, Q., Jia, Q., Liu, L., Su, J., Guo, F., & Cai, H.
Venue: Materials Science and Engineering: A
Publisher: Elsevier BV
Published: 2026-10
Volume: 973
Pages: 150760
ISSN: 0921-5093
DOI: 10.1016/j.msea.2026.150760
Cited by: 1
References: 45
Language: en
Licence: www.elsevier.com/tdm/userlicense/1.0/ (tdm)
www.elsevier.com/legal/tdmrep-license (tdm)
doi.org/10.15223/policy-017 (stm-asf)
doi.org/10.15223/policy-037 (stm-asf)
doi.org/10.15223/policy-012 (stm-asf)
doi.org/10.15223/policy-029 (stm-asf)
doi.org/10.15223/policy-004 (stm-asf)
Funders: Ministry of Science and Technology of the People's Republic of China
Department of Education of Inner Mongolia Autonomous Region

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