Research on the Al/Cu dissimilar metals laser welding process with alternating magnetic field assisted
Integrity signals
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Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
Ni has been reported to react with Al to form Al3Ni without being solutionized into Al-Cu IMCs, and contribute to forming stable ternary IMCs like Al7Cu4Ni, along with Al2Cu.
“Ni has been reported to react with Al to form Al₃Ni without being solutionized into Al-Cu IMCs [43], and contribute to forming stable ternary IMCs like Al₇Cu₄Ni, along with Al₂Cu [44].”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [44]
Cites
Dimatteo, V., Ascari, A., & Fortunato, A. (2019) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2019.06.002 · Cited by 149 · see citing works
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Singh, R., Arora, N., & Choudhary, A. (2026) · Welding in the World · doi:10.1007/s40194-026-02375-5 · Cited by 6 · see citing works
- Authors
- Zhang, L., Tan, H., Lin, H., Lv, P., Lin, L., & Zhou, J.
- Affiliations
- Guangxi University (CN)
- Corresponding author
- Zhou, Jun
- Venue
- Optics and Lasers in Engineering
- Publisher
- Elsevier BV
- Published
- 2025-01
- Volume
- 184
- Pages
- 108686
- ISSN
- 0143-8166 (ISSN-L)
- OpenAlex
- W4404168884
- Cited by
- 19
- References
- 1
- Citations by year
- 2026: 10 · 2025: 9
- FWCI
- 2.55
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- Optics and Lasers in Engineering (publishedVersion)
- Funders
- Specific Research Project of Guangxi for Research Bases and Talents (GKAD21220038)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- laser lap welding, alternating magnetic field, T2 copper, Lorentz force, molten pool, contact resistance, tensile strength, surface fluctuations, electric vehicle batteries
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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