Cited by 7Heat Transfer and Boiling StudiesSurface Modification and SuperhydrophobicityThermal properties of materials

The DOI matches its Crossref record; 39 of the 40 references it cites were found in a registry or an index.

Experimental study of a low-cost reversible thermal diode for advanced heat manipulation

Kang, Zhanxiao, Fan, Jintu·2024·Thermal Science and Engineering Progress

Overview

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Integrity signals

Registry

Crossref · 10.1016/j.tsep.2024.102662

Cites

39 of 39 references verified0 citation errors · 0 not checkable

Statistics

Verification

Claims the paper makes

The claims and statistics of this paper haven’t been checked yet.

Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.

A few free checks a day · papers already verified open instantly · results are public

Self-check

Percentages, sums and reported differences re-computed from the paper’s own numbers.

The self-check needs the paper’s full text.

Citations

Cites

Show all 40 references

Cited by

Sorted by citations

See all 7

Metadata

Authors
Kang, Z., & Fan, J.
Affiliations
Hong Kong Polytechnic University (HK)
Corresponding author
Fan, Jintu
Venue
Thermal Science and Engineering Progress
Publisher
Elsevier BV
Published
2024-07
Volume
52
Pages
102662
ISSN
2451-9049 (ISSN-L)
OpenAlex
W4399056769
Cited by
7
References
40
Citations by year
2026: 2 · 2025: 2 · 2024: 3
FWCI
0.94
Type
journal article
Language
en
Open access
closed
Locations
Thermal Science and Engineering Progress (publishedVersion)
Funders
  • Research Grants Council, University Grants Committee (15216722)
  • The Hong Kong Polytechnic University
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
  • Physical Sciences › Materials Science › Surfaces, Coatings and Films › Surface Modification and Superhydrophobicity
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
Keywords
thermal diode, heat rectification, superhydrophobic surfaces, superhydrophilic surfaces, filling factor, control valves, waste heat recovery, solar energy harvesting, building energy management

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

Are you an author, or do you see a problem with this page? Request a review

How to cite

Cite CoChat for the checks on this page, and the paper for its own findings.

This page
CoChat. (2026). Citation check: Experimental study of a low-cost reversible thermal diode for advanced heat manipulation. https://app.cochat.ai/papers/10.1016/j.tsep.2024.102662
The paper
Kang, Z., & Fan, J. (2024). Experimental study of a low-cost reversible thermal diode for advanced heat manipulation. Thermal Science and Engineering Progress. https://doi.org/10.1016/j.tsep.2024.102662