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Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer
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Research works printed but not linked: 31
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Cited by
Sorted by citations
Kumar, A., Neogy, S., Saini, S., Ittoop, M. O., Chowdhury, A., Sajith, B. K., & Ganesh, P. (2025) · Welding International · doi:10.1080/09507116.2024.2432396 · Cited by 7
Zheng, H., Liu, C.-L., Gao, Q., Wu, M.-W., & Qin, X.-P. (2026) · Journal of Materials Research · doi:10.1557/s43578-025-01765-7 · Cited by 2
Metadata
- Authors
- Xiong, J., Peng, Y., Zhang, H., Li, J., & Zhang, F.
- Venue
- Vacuum
- Publisher
- Elsevier BV
- Published
- 2018-01
- Volume
- 147
- Pages
- 187-193
- ISSN
- 0042-207X
- Cited by
- 51
- References
- 0
- Language
- en
- Funders
- State Key Laboratory of Solidification Processing (NWPU), China (141-TZ-2016)
- National Natural Science Foundation of China (51575451, 51475376)
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