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Cited by 18Copper Interconnects and ReliabilityAerogels and thermal insulationSemiconductor materials and devices

The DOI matches its Crossref record; the references it cites are not checked yet.

The effects of plasma treatment on SiO2 aerogel film using various reactive (O2, H2, N2) and non-reactive (He, Ar) gases

Kim, Jean-Jong, Park, Hyung-Ho, Hyun, Sang-Hoon·2000·Thin Solid Films
DOI 10.1016/s0040-6090(00)01295-5
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Crossref · 10.1016/s0040-6090(00)01295-5

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References 13 · Cited by 18

Research works printed but not linked: 5

  1. Garbassi, 1987, Metalloberflache, 41, 11
  2. Jiny, 1998, Mat. Res. Soc. Symp. Proc., 511
  3. Jo, 1997, J. Appl. Phys., 82, 299
  4. J.J Pankove, in: R.K. Willardson, A.C. Beer (Eds.), Academic Press, Inc., 21 (1984) 6
  5. Clark, 1977, J. Polym. Sci., 15, 2321

Metadata

Authors
Kim, J.-J., Park, H.-H., & Hyun, S.-H.
Affiliations
Yonsei University (KR)
ORCID
Venue
Thin Solid Films
Publisher
Elsevier BV
Published
2000-12
Volume
377-378
Pages
525-529
ISSN
0040-6090 (ISSN-L)
DOI
10.1016/s0040-6090(00)01295-5
OpenAlex
W2079596019
Cited by
18
References
13
Citations by year
2026: 1 · 2025: 2 · 2022: 1 · 2017: 1 · 2014: 1 · 2012: 1
FWCI
1.06
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
Thin Solid Films (publishedVersion)
Topics
  • Physical Sciences › Materials Science › Electronic, Optical and Magnetic Materials › Copper Interconnects and Reliability
  • Physical Sciences › Materials Science › Materials Chemistry › Aerogels and thermal insulation
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
Keywords
plasma treatment, hydrogen plasma, oxygen plasma, nitrogen plasma, argon plasma, helium plasma, dielectric constant, leakage current, hydroxyl groups, adsorbed water, heat treatment, intermetal dielectric, multilevel interconnects, ULSI circuits, surface passivation

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