Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip
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The actual stress values can be enlarged by up to 20% due to process-induced residual stress from manufacturing.
“While similar levels of stress has been reported in the literature[16], the actual stress values can be enlarged by up to 20% [17] due to process-induced residual stress from manufacturing.”
From Stress evolution and degradation in zero-busbar silicon photovoltaic modules under thermal cycling: A finite element study (2026) · cites this paper as [17]
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Fractal design concepts for stretchable electronics
Fan, J. A., Yeo, W.-H., Su, Y., Hattori, Y., Lee, W., Jung, S.-Y., Zhang, Y., Liu, Z., Cheng, H., Falgout, L., et al. (2014) · Nature Communications · doi:10.1038/ncomms4266 · Cited by 1,088 · see citing works
Liu, H., Nair, S. V., Gu, H., Yang, B., Wu, J., Yan, X., Lv, R., Dong, J., Yu, Y., Xu, T., et al. (2026) · Solar Energy · doi:10.1016/j.solener.2025.114206
- Authors
- Sato, K., Yoshioka, T., Ando, T., Shikida, M., & Kawabata, T.
- Affiliations
- Nagoya University (JP)
- Omron (Japan) (JP)
- Corresponding author
- Sato, Kazuo
- ORCID
- Shikida, Mitsuhiro
- Venue
- Sensors and Actuators A: Physical
- Publisher
- Elsevier BV
- Published
- 1998-10
- Volume
- 70
- Issue
- 1-2
- Pages
- 148-152
- ISSN
- 0924-4247 (ISSN-L)
- OpenAlex
- W1975672034
- Cited by
- 149
- References
- 0
- Citations by year
- 2025: 3 · 2024: 5 · 2023: 2 · 2022: 4 · 2021: 4 · 2020: 3 · 2019: 2 · 2018: 8 · 2017: 6 · 2016: 2 · 2015: 5 · 2014: 7 · 2013: 7 · 2012: 4
- FWCI
- 7.32
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Sensors and Actuators A Physical (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced MEMS and NEMS Technologies
- Physical Sciences › Engineering › Mechanics of Materials › Metal and Thin Film Mechanics
- Physical Sciences › Materials Science › Materials Chemistry › Microstructure and mechanical properties
- Keywords
- silicon thin films, uniaxial tensile testing, crystal orientation, elastic modulus, fracture strain, mechanical properties of thin films
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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