The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Wafer direct bonding: tailoring adhesion between brittle materials
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Citations
Cites
Silicon on insulator material technology
Bruel, M. (1995) · Electronics Letters · doi:10.1049/el:19950805 · Cited by 1,019
Cited by
Evolution of Microchannel Flow Passages--Thermohydraulic Performance and Fabrication Technology
Kandlikar, S. G., & Grande, W. J. (2003) · Heat Transfer Engineering · doi:10.1080/01457630304040 · Cited by 960
Frontiers of silicon-on-insulator
Celler, G. K., & Cristoloveanu, S. (2003) · Journal of Applied Physics · doi:10.1063/1.1558223 · Cited by 699
Prospects and applications of on-chip lasers
Zhou, Z., Ou, X., Fang, Y., Alkhazraji, E., Xu, R., Wan, Y., & Bowers, J. E. (2023) · eLight · doi:10.1186/s43593-022-00027-x · Cited by 319
Quasi-phase-matched nonlinear optical frequency conversion in on-chip whispering galleries
Wolf, R., Jia, Y., Bonaus, S., Werner, C. S., Herr, S. J., Breunig, I., Buse, K., & Zappe, H. (2018) · Optica · doi:10.1364/optica.5.000872 · Cited by 89
Metadata
- Authors
- Plößl, A.
- Venue
- Materials Science and Engineering: R: Reports
- Publisher
- Elsevier BV
- Published
- 1999-03-10
- Volume
- 25
- Issue
- 1-2
- Pages
- 1-88
- ISSN
- 0927-796X (ISSN-L)
- OpenAlex
- W2131076635
- Cited by
- 361
- References
- 1
- FWCI
- 17.35
- Type
- journal article
- Language
- en
- Open access
- closed
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
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- CoChat. (2026). Citation check: Wafer direct bonding: tailoring adhesion between brittle materials. https://app.cochat.ai/papers/10.1016/s0927-796x(98)00017-5
- The paper
- Plößl, A. (1999). Wafer direct bonding: tailoring adhesion between brittle materials. Materials Science and Engineering: R: Reports. https://doi.org/10.1016/s0927-796x(98)00017-5
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
