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Cited by 31Advanced Statistical Process MonitoringFault Detection and Control SystemsIndustrial Vision Systems and Defect Detection

The DOI matches its Crossref record; 11 of the 11 references it cites were found in a registry or an index.

Artificial intelligence-based sampling planning system for dynamic manufacturing process

Lee, Jang Hee·2002·Expert Systems with Applications

Overview

Integrity signals

Registry

Crossref · 10.1016/s0957-4174(01)00049-5

Cites

11 of 11 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

We couldn’t retrieve this paper’s full text, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

Citations

Cites

Show all 10 references

Research works printed but not linked: 4

  1. Bechtold, 1993, A practical guide to expert systems: part a, Instrumentation and Control Systems, 66, 41
  2. Bechtold, 1994, A practical guide to expert systems: part b, Instrumentation and Control Systems, 67, 75
  3. Gilles, 1995, Expert systems: finally ready for an industrial workout, Instrumentation and Control Systems, 68, 57
  4. Kuo, W., Wang, A., Akella, R., Nurani, R., (1996). A combined adaptive sampling strategy with limited capacity. Proceedings of ISSM'96, (pp. 235–238).

Cited by

Metadata

Authors
Lee, J. H.
Affiliations
Korea Advanced Institute of Science and Technology (KR)
Corresponding author
Lee, Jang Hee
Venue
Expert Systems with Applications
Publisher
Elsevier BV
Published
2002-02
Volume
22
Issue
2
Pages
117-133
ISSN
0957-4174 (ISSN-L)
OpenAlex
W1975995798
Cited by
31
References
10
Citations by year
2024: 2 · 2022: 1 · 2020: 3 · 2019: 1 · 2015: 2 · 2014: 3 · 2013: 2 · 2012: 2
FWCI
1.60
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
Expert Systems with Applications (publishedVersion)
Topics
  • Social Sciences › Decision Sciences › Statistics, Probability and Uncertainty › Advanced Statistical Process Monitoring
  • Physical Sciences › Engineering › Control and Systems Engineering › Fault Detection and Control Systems
  • Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Industrial Vision Systems and Defect Detection
Keywords
dynamic sampling, sampling planning, semiconductor manufacturing, wafer inspection, sampling strategy optimization, artificial intelligence, wafer bin maps, data mart, cycle time reduction, inspection throughput

About these checks

Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.

Statistics and arithmetic are recomputed, not judged.

Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.

What counts as a claim ›How we measure confidence ›How we check this ›

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Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.