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Cited by 507

The DOI matches its Crossref record; 52 of the 52 references it cites were found in a registry or an index.

Direct writing in three dimensions

Open access
Lewis, Jennifer A, Gratson, Gregory M·2004·Materials Today

Abstract

The ability to pattern materials in three dimensions is critical for several emerging technologies, including photonics, microfluidics, microelectromechanical systems, and biomaterials. Direct-write assembly allows one to design and rapidly fabricate materials in complex three-dimensional shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in ink and laser writing techniques are reviewed with an emphasis on the push toward finer feature sizes. Opportunities and challenges associated with direct-write assembly are also highlighted.

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Metadata

Authors
Lewis, J. A., & Gratson, G. M.
Venue
Materials Today
Publisher
Elsevier BV
Published
2004-07
Volume
7
Issue
7-8
Pages
32-39
ISSN
1369-7021 (ISSN-L)
OpenAlex
W2006021792
Cited by
507
References
52
FWCI
11.18
Type
journal article
Language
en
Open access
hybrid

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CoChat. (2026). Citation check: Direct writing in three dimensions. https://app.cochat.ai/papers/10.1016/s1369-7021(04)00344-x
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Lewis, J. A., & Gratson, G. M. (2004). Direct writing in three dimensions. Materials Today. https://doi.org/10.1016/s1369-7021(04)00344-x

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.