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Cited by 200

The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.

High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material

Open access
Loeblein, Manuela, Tsang, Siu Hon, Pawlik, Matthieu, Phua, Eric Jian Rong, Yong, Han, Zhang, Xiao Wu, Gan, Chee Lip, Teo, Edwin Hang Tong·2017·ACS Nano

Abstract

Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m –1 K –1 ) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by Δ T of 44–24 °C).

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Crossref · 10.1021/acsnano.6b08218

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Metadata

Authors
Loeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., Gan, C. L., & Teo, E. H. T.
Venue
ACS Nano
Published
2017-02-15
Volume
11
Issue
2
Pages
2033-2044
ISSN
  • 1936-0851 (ISSN-L)
  • 1936-086X
OpenAlex
W2585863388
Cited by
200
References
2
FWCI
8.92
Type
journal article
Language
en
Open access
green

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CoChat. (2026). Citation check: High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. https://app.cochat.ai/papers/10.1021/acsnano.6b08218
The paper
Loeblein, M., Tsang, S. H., Pawlik, M., Phua, E. J. R., Yong, H., Zhang, X. W., Gan, C. L., & Teo, E. H. T. (2017). High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material. ACS Nano. https://doi.org/10.1021/acsnano.6b08218

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